Jsr Corporation

Jsr Life Sciences Corporation

Japan As Represented by Director-general of National Institute of Infectious Diseases

Atsushi Itou

Masayoshi Suzuki

Katsumi Inomata

Takashi Nishioka

Shin-ichirou Iwanaga

Hirofumi Sasaki

Tsutomu Shimokawa

Hidenori Naruse

Masato Suzuki

Mari Matsui

Shigeru Ikawa

Satowa Suzuki

Keigo Shibayama

Kazuhiro Ikkyuu

Provided is a polymer having antimicrobial and disinfecting properties against a wide range of kinds of germs. A polymer, including: a polymer chain having a repeating unit represented by the following formula (1); and a partial structure (excluding the polymer chain) derived from a compound containing a group represented by &#x2014;NH&#x2014;. [In formula (1), Rrepresents a hydrogen atom or a methyl group, Z represents a group forming an organic ammonium salt, &#x2014;NRR(where Rand Reach independently represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group), or a substituted or unsubstituted nitrogen-containing heterocyclic group, and X represents a single bond, or a divalent linking group.] 

Polymer, antimicrobial agent, disinfectant, antimicrobial material, disinfectant material, antimicrobial method, and disinfecting method

A photosensitive insulating resin composition includes (A) an alkali-soluble resin that contains (a1) a structural unit derived from a crosslinkable monomer and (a2) a structural unit having a phenolic hydroxyl group, (B) a crosslinking agent, (C) a photosensitive compound, and (D) a solvent.

Photosensitive insulating resin composition, cured product of the composition, and method of producing insulating film

Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties.

Positive photosensitive insulating resin composition and cured product thereof

Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent. The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties.

Positively photosensitive insulating resin composition and cured object obtained therefrom

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Tokyo, Japan

Atsushi Itou