Mitsubishi Electric Corporation

Atsushi Itokazu

Hidetaka Miyake

Tatsushi Sato

Takashi Yuzawa

Takashi Hashimoto

Kazuhiko Fukushima

Yoichi Otomo

Tsubasa Yagi

A multiwire electric discharge machine includes: a plurality of guide rollers; a machining power supply that applies a voltage between each of a plurality of cutting wire sections and a workpiece; a dummy workpiece including a contact surface curved in such a way as to be capable of coming into contact with a curved surface of the workpiece except for an end point, the end point being to be reached by each of the plurality of cutting wire sections when machining of the workpiece is completed, the dummy workpiece supporting the workpiece from one side in a first direction, the first direction being a direction in which the workpiece moves; and a pressing mechanism including a pressing portion, the pressing mechanism pressing the workpiece against the dummy workpiece by bringing the pressing portion into contact with the workpiece from another side in the first direction.

Multiwire electric discharge machine, multiwire electric discharge machining method, and semiconductor wafer manufacturing method

A multi-wire electric discharge machine includes: a plurality of cutting wire sections arranged in parallel in such a way as to face a workpiece, a wire electrode being wound around guide rollers to form the cutting wire sections; a drive unit that adjusts relative distances between the workpiece and the cutting wire sections; a machining power supply that applies pulse voltages between the workpiece and the cutting wire sections; a machining-state detection device that detects machining states in the cutting wire sections; and a machining control device that controls the drive unit and the machining power supply, in which when values indicating the machining states exceed a threshold value, the machining control device outputs, to the machining power supply, commands to apply the pulse voltages according to a machining condition for avoiding breakage of the wire electrode.

Multi-wire electric discharge machine

To perform highly accurate cutting according to stable power feed from a machining power supply, a wire electric discharge machining apparatus includes a wire wound over main guide rollers a plurality of times to simultaneously perform a plurality of kinds of cutting. Wire laying work for a plurality of the wires on power feed elements is reduced, uniform power is fed to cutting wire sections, stable machining is intended, and according to alignment positions, for each of units, a plurality of the power feed elements are aligned to correspond to a wire parallel arrangement interval of the cutting wire sections set as power feed targets and are disposed to feed power to the cutting wire sections with an interval of at least every other cutting wire section.

Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus

A workpiece retainer retains a workpiece at a time of a cutting process by a wire electric discharge machining device that cuts a workpiece by electric discharge from wire electrodes that are spaced from each other and are arranged in parallel. The workpiece retainer is formed with a fitting portion, into which the workpiece is fitted substantially without any gap, and has an external shape such that at a time of cutting the workpiece retainer together with the workpiece fitted in the fitting portion, a length along the wire electrodes of a portion where the workpiece retainer and the workpiece face the wire electrodes becomes substantially constant during the cutting process of the workpiece.

Workpiece retainer, wire electric discharge machining device, thin-plate manufacturing method, and semiconductor-wafer manufacturing method

A wire electric-discharge machining device includes a control unit that selects a cutting wire to which a pulse voltage is applied by a pulse-voltage generation unit on a basis of an angle formed between an end face of a workpiece and a plane including a plurality of cutting wires, which are not parallel to the end face, an interval between parallel cutting wires, and a relative distance between the cutting wires and the workpiece. A drive unit drives a workpiece in a direction not vertical to the plane including the cutting wires, and the workpiece is cut by electric-discharge machining by applying a pulse voltage.

Wire electric-discharge machining device, wire electric-discharge machining method, thin-plate manufacturing method, and semiconductor wafer manufacturing method

A wire electric discharge machining apparatus includes a wire electrode, a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound, a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively, and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, in which the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors.

Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method

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Tokyo, Japan

Atsushi Itokazu