Ibiden Company Limited

Atsushi Ishida

Ryojiro Tominaga

Kenji Sakai

Hiroaki Kodama

Haruhiko Morita

Ayao Niki

Kazuro Nishiwaki

A method for manufacturing a printed wiring board includes forming a first conductor layer, forming an adhesive layer including a nitrogen-based organic compound and covering a surface of the first layer, forming a resin insulating layer covering the adhesive layer and having the second surface facing the first conductor layer, forming a protective film on the first surface of the insulating layer, forming an opening in the insulating layer such that the opening penetrates through the insulating layer and reaches the adhesive layer, applying plasma to the opening of the insulating layer such that the plasma cleans an inside of the opening, removing the protective film from the insulating layer after cleaning the inside of the opening, forming a second conductor layer on the first surface of the insulating layer, and forming a via conductor in the opening such that the via conductor connects the first layer and second layer.

Method for manufacturing printed wiring board and printed wiring board

An inductor built-in substrate includes a core substrate having an opening and a first through hole, a first plating film formed in the first through hole of the core substrate, a magnetic resin body having a second through hole and including a magnetic resin filled in the opening of the core substrate, and a second plating film formed in the second through hole of the magnetic resin body such that the second plating film is formed in contact with the magnetic resin body.

Inductor built-in substrate and method for manufacturing the same

An inductor built-in substrate includes a core substrate having an opening, a magnetic resin body having a through hole and including a magnetic resin filled in the opening of the core substrate, and a plating film formed in the through hole of the magnetic resin body and including an electrolytic plating film such that the electrolytic plating film is formed in contact with the magnetic resin body.

A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Method for manufacturing a wiring board

A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.

Method for manufacturing substrate with metal film

A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.

Wiring board and method for manufacturing the same

A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.

A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.

Substrate with metal film and method for manufacturing the same

A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.

Growing community of inventors

Ogaki, Japan

Atsushi Ishida