Senju Metal Industry Co., Ltd.

Honda Motor Co., Ltd.

Cemedine Co., Ltd.

Atsushi Ikeda

Isamu Sato

Hiroyoshi Kawasaki

Takahiro Roppongi

Daisuke Soma

Yuji Kawamata

Shigeki Kondo

Nobuchika Ochi

Takashi Hagiwara

Kaichi Tsuruta

Takashi Akagawa

Tomohisa Kawanago

Yasuhiro Kajikawa

Tomonori Saito

Hideharu Hashimukai

Yuichi Koikeda

Masaru Sasaki

Naoko Ishihara

Tomohiko Hashimoto

A flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. AC1 has a rate of decrease in weight of 20% by mass or less in a case of being held at 140° C. for 15 minutes. S1 has a rate of decrease in weight of 50% by mass or less in a case of being held at 140° C. for 15 minutes.

Flux and solder paste

Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600&#xb0; C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.

Curable composition for fireproofing

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 &#x3bc;m or less, and the solder material has a spherical diameter of 1 to 230 &#x3bc;m and a sphericity of 0.95 or more.

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an &#x3b1; dose of 0.0200 cph/cmor less.

Cu core ball

Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic componentis constructed by joining a solder bumpof a semiconductor chipto an electrodeof a printed circuit boardwith solder paste. The solder bumpis formed by joining an electrodeof the semiconductor chipto the Ni ball. The Ni ballaccording to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.

Ni ball, Ni core ball, solder joint, solder paste, and solder foam

A core ball wherein a junction melting temperature and a low alpha dose are set for suppressing a soft error generation and solving a mounting problem. A metallic powder as a core is a sphere. A pure degree of a Cu ball of the metallic powder is equal to or higher than 99.9% but equal to or less than 99.995%. A contained amount of one of Pb and Bi or a total contained amount of Pb and Bi is equal to or higher than 1 ppm. A sphericity of the Cu ball is at least 0.95. A solder plating film for coating the Cu ball comprises Sn&#x2014;Bi based alloy. U contained in the solder plating film is equal to or less than 5 ppb and Th is equal to or less than 5 ppb. An alpha dose of the core ball is equal to or less than 0.0200 cph/cm.

Core ball, solder paste, formed-solder, flux-coated core ball and solder joint

A microcomputer is equipped with a CPU and an AD converter. The AD converter is supplied with the same power source voltage as the CPU, and converts a reference voltage into digital data using the received power source voltage and outputs the digital data as a conversion value. The CPU detects a state of the power source voltage by calculating a voltage variation of a power source voltage for ordinary operation on the basis of a first conversion value obtained by AD-converting the reference voltage by the AD converter in a state that a standard power source voltage including no voltage variation is supplied to the AD converter and a second conversion value obtained by AD-converting the reference voltage by the AD converter in a state that the power source voltage for ordinary operation is supplied to the AD converter.

Power source voltage protective device and power source voltage protection method

In a microcomputerwhich converts an analog signal Vin into digital data and corrects an error of the digital data, a voltage variation &#x394;Vcc is calculated on the basis of a first conversion value obtained by AD-converting a reference voltage Vref by an AD converterin a state that a standard power source voltage including no voltage variation is supplied to the AD converterand a second conversion value obtained by AD-converting the reference voltage Vref by the AD converting section in a state that a power source voltage for the ordinary operation is supplied to the AD converter. The digital data produced by the AD converterby AD-converting the analog signal Vin is corrected using the calculated voltage variation &#x394;Vcc.

Growing community of inventors

Tochigi, Japan

Atsushi Ikeda