Ibiden Company Limited

Atsushi Hiroi

Mitsuhiro Kondo

Kinya Ohshima

Katsumi Sagisaka

Takeshi Takeyama

Takuji Asai

Chiaki Nakanishi

Yoji Yanagawa

An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards and the latter being integral with the frame.

Electronic-parts mounting board and electronic-parts mounting board frame

An electronic-parts mounting board frame sheet includes a plurality of electronic-parts mounting board frames serially coupled into a single sheet. Each frame includes an electronic-parts mounting board with an insulating substrate, grouped leads protruding from the insulating substrate, an outer frame integrally formed with the grouped leads, and pilot holes, located in the outer frame, for indicating the positions of the grouped leads of the electronic-parts mounting board. Further, the grouped leads and the outer frame of each electronic-parts mounting board frame are integrally formed.

A method for mounting an electronic component comprising providing an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner ends of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

Method of manufacturing a high lead count circuit board

This invention relates to a printed wiring board (10) for IC cards to be built in or fitted to a contact type IC card, that is, an IC card having external contact terminals. The present invention is to provide a printed wiring board (10) for IC cards wherein bumps (20) are formed in a part of a conductor circuit (13) of this printed wiring board (10) for IC cards and are made external contact terminals, futhermore wherein only the contact surfaces of the external contact terminals are exposed on the surface of the IC card (30) and the surfaces of the external contact terminals and the surface of an over sheet (14) are made to be on the same plane level, so that, in case the IC card (30) is bent, an IC module (12) may be perfectly prevented from springing out and further the electric contact reliability of the external contact terminal may be also high.

Printed wiring board for IC cards

A circuit board for mounting an electronic component comprises an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner end of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

High lead count circuit board for connecting electronic components to an

A method of manufacturing a substrate for mounting electronic components according to this invention comprises the steps of forming a mask on a portion to be electrically connected to an exterior of a lead frame, of forming resin layers on both side surfaces of the lead frame by prepregs or the like, of removing the resin layer on the mask, and of removing the mask, and in the substrate for mounting electronic components manufactured according to this method, the substrate is integrally formed with the lead frame, and the electrical connection of the substrate to the lead frame is performed by through hole plating without using fine metal wiring.

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Oogaki, Japan

Atsushi Hiroi