Nitto-denko Corporation

Menicon Co., Ltd.

Nitto Electric Industrial Co., Ltd.

Atsushi Hino

Naoyuki Matsuo

Masakazu Sugimoto

Kazuo Ouchi

Yoshinari Takayama

Kanji Nishida

Amane Mochizuki

Kazuo Kitada

Masakatsu Urairi

Hitoshi Ishizaka

Takaichi Amano

Shoji Morita

Takeshi Matsumura

Tomokazu Yura

Toshiki Naito

Tomonori Noguchi

Kazumi Higashi

Hiromichi Ohashi

Tomokazu Takahashi

Masayuki Kaneto

Munekazu Tanaka

Syouji Yamamoto

Yoshihiro Kameda

Kazunori Mune

Yuzuru Noda

Ryuusuke Naitou

Masako Maeda

Toshikazu Baba

Tetsuya Terada

Toshio Nakajima

Takanori Miyoshi

Mikio Aizawa

Ichiro Amino

Sunao Inoue

Yoshihisa Mori

Mika Horiike

Kazuto Shinozaki

An impact-absorbing pressure-sensitive adhesive sheet according to an embodiment of the present invention includes an impact-absorbing pressure-sensitive adhesive layer including an impact-absorbing layer. A side surface of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65&#xb0; or more.

Impact-absorbing pressure-sensitive adhesive sheet and method of producing the same

There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

Laser processing method and land laser processed product

A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same

Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.

Manufacturing method of laser processed parts and protective sheet for laser processing

Providing a method of manufacturing a laser processed part capable of processing at high speed and high precision when processing a workpiece by optical absorption ablation of laser beam, effectively suppressing contamination of a workpiece surface by decomposition products, and recovering the workpiece easily after processing. Another object is to present an adhesive sheet for laser processing preferably used in the method of manufacturing a laser processed part.

Manufacturing method of laser processed parts and adhesive sheet for laser processing

A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unitto form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism. The peeling mechanismfeeds a forwardmost one the polarizing films F to a laminating mechanismwhile peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatusin synchronization of the feeding of the forwardmost polarizing film F.

Method and system for laminating optical elements

In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 mfor the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X&#x3e;Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%).

Resin joined body

A laser processing protection sheet () capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed () is processed by the UV absorption ablation of a laser beam (). A production method for a laser processed article () using the laser processing protection sheet (). The laser processing protection sheet () is provided on the laser beam incident surface side of the article to be processed () when the article () is processed by the UV absorption ablation of the laser beam ().

Protective sheet for laser processing and manufacturing method of laser processed parts

This invention provides a process for producing a three-dimensional polyimide optical waveguide, which comprises: (I) irradiating a polyamic acid film with a laser beam while converging the laser beam at an inside portion of the film and relatively moving the light convergence point, the polyamic acid film containing: (a) a polyamic acid obtained from a tetracarboxylic dianhydride and a diamine; and (b) per 100 parts of the polyamic acid, from 0.5 part by weight to less than 10 parts by weight of a specific 1,4-dihydropyridine derivative represented by formula (I): and then, (II) heating the polyamic acid film to imidize the polyamic acid, thereby obtaining an optical waveguide having a continuous core region where the refraction index has been changed, in the thus formed polyimide film.

Process for producing three-dimensional polyimide optical waveguide

An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board

A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

Flexible wiring board

In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

Film carrier and semiconductor device using same

A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.

Method for removing residue and method for production of printed board having hole

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Ibaraki, Japan

Atsushi Hino