Sankyo Company, Limited

Disco Corporation

Atsushi Hattori

Noriyoshi Uchida

Masahiro Kitaoka

Masami Miura

Atsushi Ueki

Kouhei Furuya

Yuichiro Yabe

Tsuyoshi Hosoya

Hirohiko Kozai

Seigo Ueda

Yoshihiko Baba

Mitsuyo Takahashi

Sadamasa Minato

A tape expanding apparatus for expanding an expandable tape of a frame unit in which a workpiece is supported through the expandable tape to an annular frame includes a frame holding unit for holding the annular frame, a chuck table surrounded by the frame holding unit and having a holding surface for holding the workpiece through the expandable tape, and a position adjusting unit for adjusting a position of the workpiece with respect to the holding surface. The position adjusting unit includes a position detecting unit for detecting the position of the workpiece held on the holding surface and a position control unit having an abutting unit adapted to abut against an outer circumference of the annular frame supported by the frame holding unit and a moving mechanism for moving the abutting unit according to the position of the workpiece detected by the position detecting unit.

Tape expanding apparatus

A chip spacing maintaining apparatus for maintaining the spacing between any adjacent ones of a plurality of chips obtained by dividing a workpiece attached to an expand sheet, the expand sheet being supported at its peripheral portion to an annular frame is provided. The chip spacing maintaining apparatus includes a far-infrared radiation applying unit for applying far-infrared radiation toward the expand sheet expanded in a target area between the outer circumference of the workpiece and the inner circumference of the annular frame, thereby shrinking the expand sheet in the target area, and an air layer forming unit provided adjacent to the far-infrared radiation applying unit, the air layer forming unit having a nozzle hole for discharging a gas toward the workpiece in applying the far-infrared radiation from the far-infrared radiation applying unit toward the expand sheet, thereby forming an air layer above the workpiece.

Chip spacing maintaining apparatus

After performing a dividing step to divide a wafer into individual chips, an irradiation step is performed to apply ultraviolet radiation or plasma to the mount side of each chip, thereby generating ozone and active oxygen, which functions to remove organic matter sticking to the mount side of each chip. Accordingly, it is possible to remove from the mount side of each chip not only foreign matter sticking to the wafer during handling the wafer, but also foreign matter generated in dividing the wafer, so that faulty mounting of each chip can be reduced.

Wafer processing method for removing organic debris

Isolated cultures of Pestalotiopsis funerea IFO 5427 and Pestalotiopsis neglecta FERM BP-3501 are provided. The cultures produce a glucoamylase which digests starch.

Isolated cultures of Pestalotiopsis funerea IFO 5427 and Pestalotiopsis

A Phospholipase A1 which is capable of hydrolyzing a phospholipid to produce a 2-acyl lysophospholipid and is obtainable from species of the fungus Aspergillus.

Phospholipase A1, process for its preparation and the use thereof

A method is provided for preparing a Phospholipase A1 which comprises (a) culturing a Phospholipase A1 producing strain of Aspergillus under conditions which allow for the production of the Phospholipase A1; (b) after the culturing, diluting the culture with water or an appropriate buffer solution; (c) filtering the resulting solution under pressure to remove any insoluble matter; and optionally (d) purifying the enzyme.

Phospholipase A1, process for its preparation

Improvement in determination of an enzyme activity in a substance having an enzymatic activity which comprises employing an aromatic primary amine derivative as a substrate and an iron complex treated with a peroxide as a color reagent.

Growing community of inventors

Tokyo, Japan

Atsushi Hattori