Denso Corporation

Asmo Co., Ltd.

Hamanakodenso Co., Ltd.

Atsushi Furumoto

Hideki Kabune

Masashi Yamasaki

Hideki Minato

Ataru Ichikawa

Mitsuhiro Sugiura

Kenji Arai

Misao Tanaka

Tatsuya Kubo

Ayako Iwai

Toshihiro Fujita

Yoshinori Suzuki

Hiroyasu Kidokoro

Hiroki Kamiya

Teruhiko Iwase

Yoshimasa Kinpara

Kazuyuki Hamamoto

Hisahiro Ikeda

Sadayuki Tsuda

Hayato Kiuchi

Masayasu Yamamoto

Masayuki Fujihira

Tatuya Kubo

Masato Kamino

A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

Sleeve soldering device and method of producing electronic device

An electric component manufacturing device includes a preheater that contacts and preheats a transported work, a melting heater that is downstream of the preheater in a transport direction of the work and contacts and heats the work at a temperature which is higher than a temperature of the preheater and at which a solder melts, a cooler that is downstream of the melting heater in the transport direction and contacts and cools the work, and a transporter that supports and transports the work to sequentially contact the preheater, the melting heater, and the cooler in this order. The transporter performs intermittent transport in which the work is transported from the preheater to the melting heater without stopping to contact both the preheater and the melting heater at the same time, and then the work stops on the melting heater.

Device for manufacturing electric component and method for manufacturing electric component

A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

Reflow device and method for manufacturing substrate using the reflow device

A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module includes a mold part and is arranged along the heat receiving surface of the heat sink. Motor leads are taken out from the motor case and electrically connected to the power module and winding wires. The drive apparatus has the motor case, a control circuit substrate, the heat sink, the power module and a power circuit substrate arranged in this order in the axial direction. The motor leads are connected to the power module at an opposite side of the motor case relative to the mold part in the axial direction.

Drive apparatus including motor

A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module is arranged along the heat receiving surface of the heat sink. A control circuit substrate includes a control circuit for controlling driving of a motor and is electrically connected to the power module. A power circuit substrate is supplied with currents supplied to winding wires, and is electrically connected to the power module. In the drive apparatus, the motor case, the control circuit substrate, the power module and the power wiring part are arranged in this order in an axial direction. The power module is arranged longitudinally relative to the end surface wall in the axial direction of the motor case.

Drive apparatus

A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

Linked semiconductor module unit and electronic circuit-integrated motor device using same

A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.

Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules

An electronic control unit () including semiconductor modules (to) and capacitors (to) is disposed in the axial direction of a motor (). The semiconductor modules (to) are placed longitudinally and brought into contact with a heat sink (). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (to) is perpendicular to the axial line of the motor (). Accordingly, the capacitors (to) are disposed so that at least a part of the capacitors (to) overlap the semiconductor modules (to) and heat sink () in the axial direction of the motor ().

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

An electronic circuit including semiconductor modules and capacitors is positioned in the axial direction of a motor. Each semiconductor module is longitudinally positioned in contact with a heat sink. More specifically, a line perpendicular to the surface of a semiconductor chip included in the semiconductor module is perpendicular to the axis line of the motor. Consequently, each capacitor is positioned so that at least a part of the positional range of the capacitor in the axial direction of the motor coincides with the positional ranges of the semiconductor module and the heat sink in the axial direction.

Electronic circuit-integrated motor apparatus

A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.

Electronic circuit-integrated motor drive and semiconductor module

A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.

Drive apparatus adapted to promote heat dissipation from electronic circuit integrated therein

A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.

Drive apparatus and semiconductor module

A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

Growing community of inventors

Nukata-gun, Japan

Atsushi Furumoto