Dai Nippon Printing Co., Ltd.

Atsuo Tsuzuki

Hiroshi Yamamoto

Hiroshi Yamada

Yasuki Suzuura

Takakazu Goto

Hideki Arao

Kazuyuki Takasawa

Koujiro Ookawa

Katsutoshi Konno

Keita Arihara

Koujiro Ohkawa

Kuniaki Yoshikata

Kosuke Saeki

Marii Nishikawa

Yoshihiro Kanai

Shunsuke Furuya

A surface-emitting device includes: a light-emitting diode substrate including a supporting substrate, and a light-emitting diode element placed on one surface side of the supporting substrate; and a sealing member placed on a light-emitting diode element side surface of the light-emitting diode substrate, and configured to seal the light-emitting diode element; wherein the light-emitting diode element includes a transparent substrate including inorganic material, and a light-emitting layer formed on one surface of the transparent substrate; the light-emitting diode element is a bare chip in which the transparent substrate is exposed on a surface thereof; the sealing member is in contact with the transparent substrate on a side surface and a surface opposite side to a surface where the light-emitting layer is formed; and a haze value of the sealing member is 4% or more, and a thickness thereof is thicker than a thickness of the light-emitting diode element.

Surface-emitting device with a light emitting diode and a sealing member

An encapsulant sheet suitable for encapsulating a light-emitting element in, for example, a self-luminous display or for direct backlights. The encapsulant sheet is a single-layer or multi-layer resin sheet that includes an adhesive layer exposed at a topmost surface. The Vicat softening point is greater than 60&#xb0; C. and no higher than 100&#xb0; C. The melt viscosity of the encapsulant sheet, at a shear velocity of 2.43&#xd7;10 secand measured at a temperature of 120&#xb0; C. is at least 5.0&#xd7;10poise and no more than 1.0&#xd7;10poise. The adhesive layer contains a polyolefin and a silane component, and a content of the silane component relative to the resin component of the adhesive layer is at least 0.03% by mass and less than 10% by mass.

Encapsulant sheet for self-luminous display or encapsulant sheet for direct backlight, self-luminous display, and direct backlight

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43&#xd7;10 secand measured at a temperature of 120&#xb0; C., being 5.0&#xd7;10poise to 1.0&#xd7;10poise inclusive.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43&#xd7;10 sec-1 and measured at a temperature of 120&#xb0; C., being 5.0&#xd7;103 poise to 1.0&#xd7;105 poise inclusive.

A protective sheet for a solar battery module comprises a weather-resistant sheet () of, for example, a fluorocarbon resin, and a deposited inorganic oxide thin film () formed on one of the surfaces of the weather-resistant sheet (). A surface-treated layer () is formed in the weather-resistant sheet () to enhance adhesion between the weather-resistant sheet () and the deposited inorganic oxide thin film ().

Protective sheet for solar battery module, method of fabricating the same and solar battery module

In manufacturing a barrier-forming film, a vapor-deposited inorganic oxide film is provided on a face of a substrate film. An annealing treatment is applied to the substrate film having said vapor-deposited inorganic film. The substrate film is a resinous film which selected from a group consisting of polyesters, polyamides and polypropylenes. The annealing treatment includes a heating treatment carried out at a temperature within the range from 55&#xb0; C. to 150&#xb0; C. in order to cause thermal shrinkage of the substrate film and to increase density of the vapor-deposited inorganic oxide film. The vapor-deposited inorganic oxide film includes a vapor-deposited silicon oxide film or a vapor-deposited aluminum oxide film.

Manufacturing method of barrier-forming film

A protective sheet for a solar battery module comprises a weather-resistant sheet ( ) of, for example, a fluorocarbon resin, and a deposited inorganic oxide thin film ( ) formed on one of the surfaces of the weather-resistant sheet ( ). A surface-treated layer ( ) is formed in the weather-resistant sheet ( ) to enhance adhesion between the weather-resistant sheet ( ) and the deposited inorganic oxide thin film ( ).

The present invention provides a barrier-forming film (A) useful for manufacturing various packaging container, which has a higher barrier-formability to prevent permeation of oxygen gas or steam, and a manufacturing method thereof. The barrier-forming film of the invention comprises a substrate film ( ) having a vapor-deposited film ( ) of an inorganic oxide, and by applying an annealing treatment thereto to limit the steam permeability within a range of from 2.0 to 0.000001 g/m .day, and the oxygen permeability, within a range of from 2.0 to 0.000001 cc/m .day.

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Tokyo-to, Japan

Atsuo Tsuzuki