Hitachi Automotive Systems, Ltd.

Casio Hitachi Mobile Communications Co., Ltd.

Atsuo Soma

Kisho Ashida

Kentarou Miyajima

Hanae Shimokawa

Katsuei Ichikawa

Junji Onozuka

Makoto Ishii

Motohiro Sasaki

Keisuke Iwaishi

Yuuya Urushihata

Shohei Hata

Atsushi Kazama

Hiroshi Onuki

Satoshi Sato

Daisuke Terada

Masayuki Hio

Takuto Yamaguchi

Mizuki Shibata

Hiroyuki Oota

Shosaku Ishihara

Takeshi Ashida

A dynamic quantity measuring apparatus includes a strain sensor, a resin member, a strain body, and a boding portion. The strain sensor has a plurality of piezoresistance elements and a plurality of electrode pads formed on a surface of a semiconductor substrate. The resin member for electrical wiring is provided with a plurality of wires electrically connected to the plurality of electrode pads. The strain body is joined to a back surface of the strain sensor. The bonding portion is configured to bond the resin member for electrical wiring to the strain body. A groove is provided in a region of the resin member for electrical wiring located in a vicinity of the strain sensor.

Dynamic quantity measuring apparatus having a strain sensor disposed in a groove

A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Mechanical quantity measuring device and sensor unit

A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method

A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.

Non-contact power feeding device used in torque sensor having a coil enclosed in peripheral side of a resonance coil and is magnetically coupled with the resonance coil

A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate back surface, a power receiving-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with at least one turn at a substrate surface facing opposite the power transmitting-side substrate and the power receiving-side circuit component is mounted at another substrate surface, at the power receiving-side substrate that includes a substrate front surface and a substrate back surface; and the power transmitting-side coil and the power receiving-side coil are magnetically coupled with each other so as to allow power to be contactlessly fed from the power transmitting-side substrate to the power receiving-side substrate.

Rotating body non-contact power-feeding device and torque sensor

In a mobile phone deviceincluding a three-axial direction vibration sensorfor detecting the walking of a user carrying the mobile phone deviceand counting the number of walking steps, when an incoming call is received, vibrations due to a notification operation by a vibratoror a speakerare transmitted to the three-axial direction vibration sensor. As a result, the three-axial direction vibration sensorinevitably detects unintended vibrations in addition to vibrations from walking, causing the number of walking steps to be miscounted. To prevent this and perform the accurate detection of walking, in the present invention, the detection of walking is performed without using, among vibrations in three directions detected by the three-axial direction vibration sensor, vibrations in the same direction as the direction of vibrations caused by a notification operation by the vibratoror the speaker

Electronic device and control program thereof

Growing community of inventors

Hitachinaka, Japan

Atsuo Soma