Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Atsuo Senda

Takuji Nakagawa

Yoshihiko Takano

Tohru Kasanami

Osamu Kanoh

Osamu Kano

Toshi Numata

Yoshifumi Ogiso

Masahiko Kawaguchi

Masahiro Bando

Kazuhiro Morita

Yutaka Sasaki

Yukio Sakabe

Masaaki Taniguchi

Toshimi Kaneko

Tetsuya Morinaga

Toshikazu Takeda

Tomoaki Ushiro

Mitsunao Okumura

Yasushi Yoshida

Shunjiro Imagawa

Yasuo Fujiki

Hideyuki Kashio

Toru Kasanami

Suehiro Kato

Toshio Ogawa

Ryuichi Fujinaga

Satoshi Shindo

A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Chip-type circuit component and method of manufacturing the same

Inexpensive methods for producing small-sized monolithic electronic parts with improved functions by which an electroconductive film can be formed uniformly, thin, and in fine patterns on a ceramic green sheet, a carrier film, or a resin film, for example. A plurality of such ceramic green sheets, etc., each having the electroconductive film formed thereon, are laminated to give a ceramic laminate, which is then sintered. The electroconductive film is formed on each ceramic green sheet, etc., by the steps of: applying a hydrophilic liquid containing an activating catalyst comprising copper oxide, a palladium salt and an alkaline solution, for example, to thereby form a photosensitive film comprising said liquid containing said activating catalyst, exposing the photosensitive predetermined regions to thereby deposit palladium catalyst on said regions, washing out the non-exposed regions of the photosensitive film with water or a liquid consisting essentially of water, and dipping the ceramic green sheet having palladium catalyst deposited thereon in an electroless plating bath to thereby form the intended electroconductive film by electroless plating.

Method for producing monolithic electronic parts

Thin film chip-type filter with an external electrode formed on an

A chip coil includes an insulating substrate on which a spiral coil conductor and first and second terminal electrodes are formed. The coil conductor and the terminal electrodes are made by forming a conductive film on the whole of both main surfaces of the insulating substrate and then etching the same. A first insulation film made of polyimide or polyamide is formed on the insulating substrate so as to cover the coil conductor and the terminal electrodes. The first insulation film is etched such that portions corresponding to the terminal electrodes are removed and a throughhole is formed at a portion corresponding in position to the inner most end of the coil conductor. A further conductive film is formed on the first insulation film and etched so as to form a connecting conductor, the ends of which are respectively connected to the inner most end of the coil conductor and the second terminal electrode through the throughhole. In addition, a second insulation film is formed on the insulating substrate and succeedingly etched, whereby the first and second terminal electrodes are exposed.

Chip coil and manufacturing method thereof

Electrodes are formed on an electronic part by an initial step of forming electrodes on a ceramic substrate, dipping the ceramic substrate in a noble metal solution for activating the surface of the electrodes by the use of a noble metal, and forming a solder layer or a tin layer on the activated surface of the electrode by electroless plating using 3-valence titanium ion as a reducing agent. The electrodes to be formed on the ceramic substrate may be a double layer comprised of a first layer containing silver, silver-palladium, silver-platinum or copper and a second electroless nickel plated layer. In the step of forming a solder layer or a tin layer on the activated surface of the electrode by electroless plating using 3-valence titanium ion a reducing agent, it is preferable to add a metal ion except tin and lead in the plating bath. Preferably, the metal ion added in the plating bath may be alkali earth metal element or may be at least one ion selected from the group consisting of Mg.sup.2+, Ca.sup.2+, Sr.sup.2+, Ba.sup.2+, Al.sup.3+, Mn.sup.2+, Fe.sup.3+, Co.sup.2+, Ni.sup.2+, and Zn.sup.2+.

Method for forming an electrode on an electronic part

Disclosed herein is a method of preparing an InSb thin film, which comprises a step of physically sticking InSb powder onto a major surface of a substrate, and a step of depositing an InSb thin film on the major surface of the substrate provided with the as-stuck InSb powder by a method such as vacuum evaporation.

Method of preparing InSb thin film

A ferroelectric thin film element 1 constructed by forming a MgO thin film 3 oriented in the direction (100), a lower electrode 4 composed of an alloy thin film of a Ni--Cr--Al system oriented in the direction (100), a ferroelectric thin film 5 composed of a PbTiO.sub.3 thin film oriented in the direction (111), and an upper electrode 6 in this order on a substrate composed of (100) silicon 2.

Ferroelectric thin film element

First, an aqueous solution of water soluble compounds or an aqueous solution of water soluble complexes, which is a salt of elements belonging to the 6A, 7A, 1B, 2B, 3B, 4B, 5B, 6B, or 8 group in a periodic table are prepared. The pH of the aqueous solution is adjusted and titanium trichloride is added thereto. The aqueous solution provided with titanium trichloride is stirred at temperature below the boiling point of the solution under atmospheric pressure or under high pressure. Then, by the reducing action of the titanium trichloride, a fine titanium-free powder selected from the group consisting of a metal powder, an alloy powder containing two or more of metals and non-metals, or a compound powder containing two or more of metals and non-metals is obtained.

Method of producing fine powders

In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60.degree. C. and a pH value of 8.6 to 8.8.

Electroless bismuth plating bath

In order to provide an electroless plating solution containing trivalent titanium ions for serving as a reductant which can deposit a plating film in a pH range between a weak acid level and a weak alkaline level with excellent stability, carbonate such as sodium carbonate or potassium carbonate is contained in the electroless plating solution.

Electroless plating solution

Disclosed herein is an electroless solder plating bath capable of autocatalytically depositing solder on a metal such as copper or nickel or an activated non-conductor base material in an arbitrary film thickness and an arbitrary film composition. This plating bath contains bivalent ions of tin and bivalent ions of lead as metal ions, a complexing agent, and a reductant, while the reductant contains trivalent titanium ions. The plating bath can be used at a temperature of 40.degree. to 80.degree. C., with a pH value of 5.0 to 11.0.

Electroless solder plating bath

A high-frequency inductor comprising an insulating substrate; and a conductive land formed on the insulating substrate, the conductive land comprising at least two thin films formed of different compositions of metals, each of the metals is to be etched by such an etching agent that substantially never removes the other metals, the thin films being accumulated vertically.

High-frequency inductor and manufacturing method thereof

A process of forming an LC composite part. The process includes the steps of: forming a substrate having a capacitor section by laminating ceramic sheets having a plurality of capacitor electrodes formed thereon such that the ceramic sheets and electrode layers alternate, sintering the substrate, forming a plurality of coil sections on the sintered substrate, cutting the substrate into composite parts, and electrically connecting the capacitor electrode layers with the coil section.

Method of producing an LC composite part and an LC network part

An electroless plating bath for depositing a metal selected from the group consisting of Ni, Zn, As, Cd, In, Sb, Pb and alloys thereof, which contains a titanium (III) compound as a reducing agent. Typical titanium (III) compounds are titanium halides, cyclopentadienyl complex compounds of titanium (III) ions, titanium sulfate, and titanium hydroxide.

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Kyoto, Japan

Atsuo Senda