Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Atsuo Nishihara

Keisuke Horiuchi

Kinya Nakatsu

Mutsuhiro Mori

Ryuichi Saito

Akihiro Tamba

Takayoshi Nakamura

Takahiro Daikoku

Noriyuki Ashiwake

Kenichi Kasai

Toshio Hatada

Takeshi Matsuo

Haruki Hamada

Masanori Musou

Osamu Suzuki

Shigeo Ohashi

Sunao Funakoshi

Shigeyuki Sasaki

Hideyuki Kimura

Morio Kuwano

Yosuke Yasuda

Yosei Hara

Hiroshi Hozoji

Toshiaki Ishii

Tadakatsu Nakajima

Nobutake Tsuyuno

Motohiro Sato

Hisashi Tanie

Eiichi Ide

Takashi Hirao

Akira Matsushita

Takashi Naganawa

Rintaro Minamitani

Michiaki Hiyoshi

Heikichi Kuwahara

Akihiro Namba

Hiromi Shimazu

Akio Idei

Katsunori Azuma

Kenichiro Nakajima

Hiroshi Inouye

Yuichiro Konishi

Yukio Hattori

Yasuhiro Nemoto

Takehide Yokozuka

Toshiki Iino

Hiroshi Shintani

Tomoo Hayashi

Shuichi Terakado

Keizou Kawamura

Ken Maeda

Toshio Hatsuda

Hiroshi Houzouji

Mitsuru Honma

Keizo Kawamura

Junri Ichikawa

Toshio Otaguro

A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.

Power semiconductor device having a distance regulation portion and power conversion apparatus including the same

In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected. For these reasons, an object to be achieved by the invention is that the semiconductor element can be cooled from both surfaces by alternately arranging the semiconductor component having the incorporated semiconductor element and the cooling device. The above-described object can be achieved as follows. A substantially rectangular thin plate is subjected to mountain bending and valley bending so as to form a shape having as many recesses as the number of the mounted semiconductor components having the incorporated semiconductor element. Concurrently, a lateral side in a direction orthogonal to the above-described bending direction is bent so as to dispose the case in which all edges configuring an outer shape of the thin plate are arranged on substantially the same plane. The semiconductor component having the incorporated semiconductor element is arranged at a position serving as the recess of the case. The cooling devices are arranged so as to interpose the semiconductor component having the incorporated semiconductor element via the case. The semiconductor component having the incorporated semiconductor element is sealed with a silicone gel. In addition, preferably, the case is configured to include metal which has high heat conductivity. More preferably, the case is configured to include aluminum, copper, or an alloy whose principal components are both of these.

Power-module device, power conversion device, and method for manufacturing power-module device

When the power is normally supplied from the commercial power supply, the storage battery is charged by reducing the DC voltage by the charge/discharge chopper. The switching unit is provided in the previous stage of the converter. When the commercial power supply is in an abnormal state, the three-phase AC converter is operated as three discharge choppers connected in parallel by supplying the power of the storage battery to the converter and boosting the power by the switching element included in the converter. The power of the storage battery is boosted by the charge/discharge chopper, and a part of the discharging power is supplied. One three-phase AC reactor is provided in the previous stage of the converter, and the three-phase AC reactor has three coils, magnetic leg iron cores having the coils winding around them, and one leg without a coil winding around it connected in parallel.

Uninterruptible power-supply system

A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.

Power converter

A power conversion apparatus includes: a power semiconductor module (); a flow channel forming body () for housing the power semiconductor module (); and a cover () for fixing the power semiconductor module () to the flow channel forming body (), and the power semiconductor module () includes a power semiconductor element, main terminals () electrically connected to the power semiconductor element, and a case for housing the power semiconductor element, the cover () has a recessed portion () and an opening () provided in a bottom surface portion of the recessed portion (), the power semiconductor module () is placed to be fitted into the recessed portion (), the power semiconductor module () is fixed to the cover () so that the main terminals () pass through the opening (), the case and an inner wall of the recessed portion () have an airtight structure, and therefore prevents intrusion of a coolant into the power semiconductor module having a double-sided cooling structure and outflow of the coolant to outside of the module.

Power conversion apparatus

An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has: a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

Electric power converter

A power conversion device includes: a cooling basein which a flow passagethrough which a cooling medium flows is formed and an opening portionwhich is communicated with the flow passageis formed; a power module; and a flow passage control portion. The power modulehas a bottomed cylindrical portionin which a power semiconductor element is housed and which is inserted into the flow passagethrough the opening portion, a flange portionwhich is formed on an opening of the cylindrical portionand is fixed to the cooling baseso as to close the opening portion, and a group of radiator finswhich are mounted on an outer peripheral surface of the cylindrical portionwith a gap of a predetermined distance formed between the flange portionand the group of radiator fins. The flow passage control portionis arranged in a gap formed between the flange portionand the group of radiator fins, and introduces the cooling medium into the group of radiator finswhile preventing the cooling medium from flowing into gaps

Power conversion device

A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle

A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.

Semiconductor power module, inverter, and method of manufacturing a power module

Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.

Power inverter

An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Electrical apparatus, cooling system therefor, and electric vehicle

An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.

In an electronic apparatus having a heat-generating element therein, a cooling jacketfor transmitting heat generated from the heat-generating elementinto to a liquid coolant flowing therein, comprises: a coverbuilding up a heat transfer surface to be in contact with a surface of the heat-generating element; a passagefor the liquid coolant, which is formed neighboring with the heat transfer surface and wound round in a 'S'-like manner within an inside of a main bodyof the cooling jacket; and an inletand an outletattached at both ends of the flow passage of the liquid coolant, and further a dispersion memberis disposed in the flow passage, being built up by gathering a plural number of members, each of which has a 'U'-like cross-section of an aspect ratio from 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element thereto with high efficiency, and thereby enabling to cool down the heat-generating element, fully, even with a relatively small amount or volume of the liquid coolant.

Cooling jacket

Growing community of inventors

Kashiwa, Japan

Atsuo Nishihara