Nichia Corporation

Atsuo Michiue

Tomonori Morizumi

Hiroaki Takahashi

Yasuhiro Kawata

Akinori Yoneda

Yuji Matsuyama

Shinji Suzuki

Kousuke Ise

Shingo Masui

Shingo Tanisaka

Hideyuki Fujimoto

A light-emitting element includes: a first conductive semiconductor layer; a plurality of rods disposed on the first conductive semiconductor layer, the rods comprising a first conductive semiconductor; a first insulating film disposed on a surface of the first conductive semiconductor layer while being absent under the rods; a plurality of light-emitting layers disposed on lateral surfaces of the rods; a plurality of second conductive semiconductor layers disposed on outer sides of the light-emitting layers; and a plurality of second insulating films disposed at upper ends of the rods.

Light-emitting element

A light emitting element includes: a substrate; a base layer disposed on the substrate; at least one rod-shaped light emitting portion comprising: a first conductivity type semiconductor rod disposed on the base layer and having a plurality of side surfaces arranged to form a polygonal column shape, an active layer formed of a semiconductor and covering the side surfaces of the first conductivity type semiconductor rod, and a second conductive type semiconductor layer covering the active layer. The active layer includes a plurality of well layers respectively disposed over at least two adjacent side surfaces among the plurality of side surfaces of the first conductivity type semiconductor rod. Adjacent well layers among the plurality of well layers are separated from each other along a ridge line where the at least two adjacent side surfaces are in contact with each other.

Light emitting element

A method of manufacturing a light-emitting element includes: forming a plurality of masks on a surface of a first conductive semiconductor layer; forming a plurality of rods comprising a first conductive semiconductor by partially removing, in a depth direction, a portion of the first conductive semiconductor layer exposed from the masks by etching; forming an insulating film on the rods and a surface of a the remaining first conductive semiconductor layer; performing wet etching, in a state in which a mask covering the insulating film is not formed, to remove a first portion of the insulating film on lateral surfaces of the rods but retaining a second portion of the insulating film on a surface of the first conductive semiconductor layer; forming a plurality of light-emitting layers covering the lateral surfaces of the rods; and forming a plurality of second conductive semiconductor layers covering outer peripheries of the light-emitting layers.

Light-emitting element and method of manufacturing same

A light emitting element includes: a first conductivity type semiconductor rod having a plurality of side surfaces arranged to form a polygonal column shape; an active layer formed of a semiconductor and covering the side surfaces; and a second conductive type semiconductor layer covering the active layer. The active layer includes a plurality of well layers respectively disposed over at least two adjacent side surfaces among the plurality of side surfaces. Adjacent well layers among the plurality of well layers are separated from each other along a ridge line where the at least two adjacent side surfaces are in contact with each other. The active layer further includes a ridge portion formed of a semiconductor and disposed on the ridge line, the ridge portion connecting the adjacent well layers. A bandgap of the ridge portion is wider than a bandgap of each of the plurality of well layers.

A method of manufacturing a light-emitting element includes: forming a plurality of rod-shaped layered structures by performing steps including: forming a first conductive-type semiconductor layer on a substrate, forming, on the first conductive-type semiconductor layer, an insulating film defining a plurality of openings and a plurality of rods of a first conductive-type semiconductor, wherein each of the rods is disposed through a respective one of the plurality of openings, forming a light-emitting layer covering outer surfaces of the plurality of rods, and forming a second conductive-type semiconductor layer covering outer surfaces of the light-emitting layer; forming a photoresist pattern covering a portion of the plurality of the rod-shaped layered structures; removing a portion of the insulating film in a region that is not covered by the photoresist pattern; and removing a portion of the plurality of rod-shaped layered structures in the region that is not covered by the photoresist pattern.

Method of manufacturing light emitting element

A method for producing a nitride semiconductor device. The method comprises providing a substrate made of a material other than a nitride semiconductor. The material has a hexagonal crystal structure. An upper face of the substrate has at least one flat section. The method further comprises growing a first nitride semiconductor layer on the upper face of the substrate. The first nitride semiconductor layer is made of monocrystalline AlN. The first nitride semiconductor layer has an upper face that is a +c plane. The first nitride semiconductor layer has a thickness in a range of 10 nm to 100 nm. The method further comprises growing a second nitride semiconductor layer on the upper face of the first nitride semiconductor layer. The second nitride semiconductor layer is made of InAlGaN (0&#x2264;X, 0&#x2264;Y, X+Y&#x3c;1). In an initial stage of growing the second nitride semiconductor layer, micronuclei are formed in multiple locations on the upper face of the first nitride semiconductor layer such that a plurality of upside-down hexagonal pyramid-shaped or upside-down hexagonal frustum-shaped recesses separate the micronuclei above the at least one flat section of the upper face of the substrate. After the initial stage of growing, further growth is performed to reduce a size of the recesses until the recesses are substantially eliminated. The further growth is performed such that the recesses are substantially eliminated before a thickness of the second nitride semiconductor layer grows to 800 nm. The second nitride semiconductor layer is grown to have an upper face with at least one flat section.

Method for producing nitride semiconductor device

Nitride semiconductor device and method for producing the same

A method for producing a nitride semiconductor device. The method comprises providing a substrate made of a material other than a nitride semiconductor. The material has a hexagonal crystal structure. An upper face of the substrate has at least one flat section. The method further comprises growing a first nitride semiconductor layer on the upper face of the substrate. The first nitride semiconductor layer is made of monocrystalline AlN. The first nitride semiconductor layer has an upper face that is a +c plane. The first nitride semiconductor layer has a thickness in a range of 10 nm to 100 nm. The method further comprises growing a second nitride semiconductor layer on the upper face of the first nitride semiconductor layer. The second nitride semiconductor layer is made of InAlGaN (0&#x2266;X, 0&#x2266;Y, X+Y&#x3c;1). In an initial stage of growing the second nitride semiconductor layer, micronuclei are formed in multiple locations on the upper face of the first nitride semiconductor layer such that a plurality of upside-down hexagonal pyramid-shaped or upside-down hexagonal frustum-shaped recesses separate the micronuclei above the at least one flat section of the upper face of the substrate. After the initial stage of growing, further growth is performed to reduce a size of the recesses until the recesses are substantially eliminated. The further growth is performed such that the recesses are substantially eliminated before a thickness of the second nitride semiconductor layer grows to 800 nm. The second nitride semiconductor layer is grown to have an upper face with at least one flat section.

A method of manufacturing a semiconductor device includes: forming a ridge on a semiconductor layer stacked on a substrate by removing a part of the semiconductor layer; forming an electrode on the ridge so as to have a flat portion having a flat surface substantially parallel to the upper surface of the ridge and sloped portions on both sides of the flat portion with each of the sloped portions having a sloped surface that is sloped with respect to the upper surface of the ridge; forming a protective film disposed on each side of the ridge to cover a region from the side surface of the ridge to the sloped surface of the sloped portion of the electrode; and forming a pad electrode at least on an upper surface of the electrode and the protective film.

Method of manufacturing semiconductor device

A semiconductor device includes a semiconductor layer stacked on a substrate, a stripe-shaped ridge formed on a surface of the semiconductor layer, and electrode formed on an upper surface of the ridge and a protective film disposed on each side of the ridge. The electrode includes a flat portion having a flat surface substantially parallel to the upper surface of the ridge and sloped portions on both sides of the flat portion with each of the sloped portions having a sloped surface that is sloped with respect to the upper surface of the ridge. The protective film covers a region from a side surface of the ridge to the sloped surface of the sloped portion of the electrode.

Semiconductor device and method of manufacturing semiconductor device

A first nitride semiconductor layer laminating step includes a first step and a second step. In the first step, an entire upper surface of the sapphire substrate is coated with a first nitride semiconductor layer, while supplying oxygen. In the second step, crystals of the first nitride semiconductor layer are grown by supplying oxygen at a smaller flow rate than that of oxygen supplied in the first step, or without supplying the oxygen.

Method for manufacturing nitride semiconductor element

To provide a ridge-type semiconductor laser element capable of preventing inclination at the time of junction-down bonding and having high heat dissipation, in a semiconductor laser element including a substrate, a semiconductor portion disposed on the substrate and having a ridge on a surface at an opposite side from the substrate, an electrode disposed on a ridge, an insulating layer disposed on the semiconductor portion at the both sides of the ridge and a pad electrode disposed on the electrode, in which, the pad electrode side is a mounting surface side, the pad electrode is disposed extending on the insulating layer, and a spacer is disposed between the semiconductor portion and the pad electrode at parts spaced apart from the ridge.

Semiconductor laser element

A nitride semiconductor laser element includes a nitride semiconductor layer of a first conduction type, an active layer, and a nitride semiconductor layer of a second conduction type that is different from the first conduction type are laminated in that order, a cavity end face formed by the nitride semiconductor layers, and a protective film formed on the cavity end face. The nitride semiconductor layers of the first and second conduction types have layers containing Al, and the active layer has layer containing In. The protective film has a region in which an axial orientation of crystals is the same as that of the cavity end face on the nitride semiconductor layers of the first and second conduction types, and has another region in which an axial orientation of crystals is different from that of the cavity end face on the active layer.

Nitride semiconductor laser element

A nitride semiconductor laser device includes, on a first principle face of the (0001) of a nitride semiconductor substrate, a nitride semiconductor layer having a first conductivity type, an active layer, and a nitride semiconductor layer having a second conductivity type that is different from the first conductivity type, and being formed a stripe ridge on the surface thereof. The (000-1) face and an inclined face other than the (000-1) face are exposed on a second principal face of the nitride semiconductor substrate. The inclined face other than the (000-1) face represents no less than 0.5% over the surface area of the second principal face.

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Anan, Japan

Atsuo Michiue