Nec Corporation

Other

Taiyo Yuden Kabushiki Kaisha

Atsuo Itoh

Toshio Suzuki

Yutaka Hayashi

Hideyo Iida

The invention switches and forwards information data packets when a plurality of the packets having the same address are competing for simultaneous attention. A plurality of sorting circuits are coupled in a hierarchial cascade. All competing packets are originally received by a superior circuit in the hierarchial cascade. It processes the packet which wins a competition for its attention and passes the rest of the non-winning packets down the hierarchial cascade for processing by an inferior circuit.

Packet switching system having arbitrative function for competing packets

A switching system transfers information cells from time positions on incoming TDM channels to selected time positions on a particular outgoing TDM channel. Each information cell contains an address which controls the switching and data which is the transmitted message. A first time buffer delays the incoming information cell from the time position which in occupies on the incoming channel to a time position which is appropriate for the switching. After a switching, a second time buffer delays the outgoing signal unit the time position designated by the address. The alignments of the time positions on the outgoing channels are such that there is no conflict if a plurality of switching systems simultaneously feed information cells to the same outgoing channel.

Packet switching system

A thin-film forming device has a support frame for supporting a substrate to be coated with a thin film, a reaction chamber having a space surrounded by the substrate supported on the support frame, side walls mounted under both sides of the substrate and a bottom wall mounted under the side walls, an atomizer for delivering an atomized solution of a material to be coated on the surface of the substrate, a heater disposed behind the substrate for heating the substrate to a temperature higher than a reaction temperature of the material, and a nozzle connected to the atomizer and disposed in the reaction chamber in facing relation to the substrate for spraying the atomized solution toward the surface of the substrate, and cooling means for cooling at least an inside portion of the bottom wall in facing relation to the substrate to a temperature below the reaction temperature of the material.

Growing community of inventors

Tokyo, Japan

Atsuo Itoh