Yamaha Corporation

Yamaichi Electronics Co., Ltd.

Yamaha Fine Technologies Co., Ltd.

Atsuo Hattori

Masahiro Sugiura

Shuichi Sawada

Tetsutsugu Hamano

Junya Matsuoka

Toshitaka Yoshino

Yoshiki Terada

Kenichi Miyazawa

Satoshi Hibino

Chiharu Iriguchi

A catalysis combustion type gas sensor that detects an inflammable gas includes a heat-insulating portion; a heater that is formed on the heat-insulating portion; a gas reaction film that is formed on the heater on the heat-insulating portion and includes a carrier carrying a combustion catalyst for the inflammable gas; a temperature-measuring element that is formed in the vicinity of the gas reaction film on the heat-insulating portion; and a soaking portion that is formed on the heat-insulating portion and is arranged between the heat-insulating portion and the gas reaction film. The soaking portion is configured so as to decentralize heat transferred to the soaking portion in the entire soaking portion.

Catalysis combustion type gas sensor

A vibration sensor for a musical instrument includes a substrate, a first electrode film that is formed on the substrate, a piezoelectric film that is formed on the first electrode film, a second electrode film that is formed on the piezoelectric film, an insulating film that is formed on the second electrode film, and a shield film that is formed on the insulating film, the shield film being made of a conductive material, electrically connected to the first electrode film and insulated from the second electrode film by the insulating film.

Vibration sensor for musical instrument and pickup saddle

One-dimensional acceleration sensor includes: a semiconductor substrate having a constant thickness; parallel second through trenches through the substrate defining a flexible beam therebetween, having width significantly smaller than thickness; four piezo resistors formed at four corner regions of the flexible beam; first through trench through the substrate, continuous with ends of the first through trenches to define a weight continuous with one end of the flexible beam, including a pair of symmetrical first portions sandwiching the flexible beam and a second portion coupling the first portions and one end of the flexible beam, and having a center of gravity at an intermediate position on a longitudinal center line of the flexible beam; and one-layer wirings formed above the flexible beam, serially connecting piezo resistors at a same edge, and leading interconnection points generally along a longitudinal direction of the flexible beam.

Uniaxial acceleration sensor

A fine mold comprises a regeneration target film forming a convex part of a formation surface, and a light shielding unit that is configured deeper than a bottom of the formation surface and that regenerates the regeneration target film. A manufacturing cost of a product having a three-dimensional structure can be reduced.

Fine mold and method for regenerating fine mold

An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.

Electronic component and method of forming the same

Find mold and method for regenerating fine mold

A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.

Manufacture of probe unit having lead probes extending beyond edge of substrate

A probe unit to be fixed to a probe device for testing functions of a test body. The probe unit includes: a substrate; probe pins formed on the substrate by lithography, the probe pins having distal ends protruded from the substrate and being made in contact with electrodes of the test body; and a positioning member formed on the substrate by lithography at a predetermined position relative to the probe pins, the positioning means abutting upon a member for positioning the substrate relative to the probe device.

Probe unit and its manufacture

A probe unit has a plurality of metal leads regularly juxtaposed on the surface of a substrate. Each metal lead has a resilient contact piece in a front portion of the lead, the resilient contact piece being spaced apart from the substrate surface or extending over an edge of the substrate. The cross sectional shape of the resilient contact piece is an arc shape and/or has a projection near at the distal end of the resilient contact piece.

Probe unit having resilient metal leads

A method of manufacturing a field emission element comprises steps of: (a) forming a base layer comprising a gate film being capable of chemical reaction accompanied by volume expansion; (b) forming an insulating film on said base layer; (c) forming a taper-shaped first hole in said insulating film; (d) forming a second hole in said gate film by anisotropically etching said gate film using said insulating film as a mask; (e) reacting a part of a surface layer of said gate film to form a volume-expanded film by chemical reaction; (f) forming an emitter film made of an electrically conductive material on said insulating film and said expanded film; and (g) exposing said emitter film and said gate film by removing unnecessary parts comprising said substrate and said expanded film.

Manufacture of a field emission element with fined emitter electrode

A method of manufacturing a field emission device. The method having the steps of preparing a field emitter array having a plurality of electron emitting elements made of conductive material capable of emitting electrons upon application of an electric field, and impinging particle beams upon the plurality of electron emitting elements at the same time to mill a tip of each electron emitting element and form a sharp tip.

Manufacture of field emission device

A method of manufacturing a field emission element including the steps of: depositing an emitter electrode film on the surface of an emitter portion forming recess formed on a substrate; forming an emitter portion of an emitter electrode by removing the emitter electrode film deposited on the bottom of the emitter portion forming recess; depositing a sacrificial film on the surface of the emitter electrode and on the bottom of the emitter portion forming recess, and thereafter depositing a second gate electrode film on the surface of the sacrificial film. With this manufacture method, field emission elements having small unevenness in vertical positions of emitter and gate electrodes can be formed.

Manufacture of field emission element

In a field emission element manufacture method, a gate electrode having a gate hole and a getter film having a through hole communicating with the gate hole are formed on the surface of a substrate. A sacrificial film is formed over the substrate to form a mold which is used when an emitter electrode is formed, the sacrificial film covering the side walls of the gate hole and through hole and the partial surface of the substrate exposed via the holes. An emitter electrode is formed covering the surface of the mold, and thereafter the gate hole and emitter electrode are exposed to obtain a field emission element. The vacuum degree in a flat panel display can be raised and molecules are prevented from attaching to the surface of the emitter electrode.

A gate film made of conductive material is formed on a substrate, and a resist pattern having an opening with a predetermined shape is formed on the gate film. The resist pattern is reflowed to make the opening have a tapered shape. By using the resist pattern having the taper shaped opening, the gate film and substrate are anisotropically etched to form a taper shaped opening through the gate film and in the substrate to some depth. After the left resist pattern is etched and removed, the first sacrificial film is formed covering the gate film and substrate with the opening to thereby form an emitter film of conductive material on the first sacrificial film. Unnecessary portions are etched and removed to expose the emitter and gate film and complete a field emission element.

Growing community of inventors

Iwata, Japan

Atsuo Hattori