Panasonic Corporation

Atsunobu Iwamoto

Hiroyuki Yamada

Hidenobu Nishikawa

Shuichi Takeda

Daido Komyoji

Shigeru Kondou

Memory card () includes at least semiconductor chip (), circuit board () with semiconductor chip () mounted on main surface (), having at least rigidity reducing portion () formed in main surface () or in a linear region of surface () opposite to the main surface, and cover portion () for covering semiconductor chip () on main surface () of circuit board (), wherein circuit board () has a plurality of convex regions () which flex in a convex shape toward main surface () due to rigidity reducing portion ().

Memory card

A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board.

Memory card and method for manufacturing memory card

A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

Growing community of inventors

Yamagata, Japan

Atsunobu Iwamoto