Nec Corporation

Nec Lcd Technologies, Ltd.

Lenovo Innovations Limited

Atsumasa Sawada

Shinji Watanabe

Junya Sato

Nobuhiro Mikami

Katsumi Abe

Kenichiro Fujii

Osamu Ishibashi

Kazuhisa Sunaga

Nozomu Nishimura

Hideyuki Sugita

Ayami Tanabe

Kenji Kobayashi

Hiroshi Kajitani

Suguru Watanabe

Toru Taura

Hiroaki Fukunishi

A switching output circuit is provided that enables an accurate control of output power. To achieve the objective, a switching output circuit according to an exemplary aspect of the present invention includes eight switching means, two electric storage means, and a control means, wherein the control means controls the switching means and switches a conduction state and a non-conduction state, by which the power supplied from a direct-current power supply is switched and supplied to an inductive load.

Switching output circuit

A pulsed discharge device according to an exemplary aspect of the present invention includes a controller configured to determine an interruption time to a discharge time based on a predetermined time ratio between the discharge time and the interruption time when performing a pulsed discharge to repeat alternately a discharge and a pause in discharging of a chemical battery.

Pulsed discharge device and pulsed discharge method

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board, a semiconductor packageis mounted on a curved boardincluding a curved surface on at least a portion thereof. The curved boardincludes a pedestal portiondisposed on a region of the curved surface portion where the semiconductor packageis mounted and having an upper surface thereof formed flat, and a plurality of pad portionsdisposed on the flat surface of the pedestal portion. The pedestal portionis formed of an insulating material. The semiconductor packageis mounted on the pad portions

Mount board and electronic device

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount boarda semiconductor packageis mounted on a curved boardincluding a curved surface on at least a portion thereof. The curved boardincludes a pedestal portiondisposed on a region of the curved surface portion where the semiconductor packageis mounted and having an upper surface thereof formed flat, and a plurality of pad portionsdisposed on the flat surface of the pedestal portionThe pedestal portionis formed of an insulating material. The semiconductor packageis mounted on the pad portions

The present invention can provide new spirooxazine radical derivatives of the following general formula (1) which have chromic property enabling the distinction between the radical species and the cation species on the basis of absorption wavelength: 

Spirooxazine radical derivatives and reversible isomerization reaction

A circuit board device includes: plurality of wiring boards (and) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member () arranged between wiring boards (and) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block () composed of a metal material and arranged between the wiring boards (and) to enclose anisotropic conductive member (), and a pair of holding blocks (and) composed of a metal material arranged to clamp the plurality of wiring boards (and), wherein the plurality of wiring boards (and), while in a state of being clamped between the pair of holding blocks (and), is connected together by the anisotropic conductive member () and the terminals provided on each of the wiring boards (and), the functional block (), and the holding blocks (and) are electrically connected.

Circuit board device, wiring board interconnection method, and circuit board module device

A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards-, anisotropically conductive membersplaced between the individual wiring boards, functional blocksseparate from anisotropically conductive membersand are placed on the same plane as anisotropically conductive membersso as to enclose anisotropically conductive members, and a pair of holding blocksplaced to sandwich wiring boards-. These wiring boards-are kept compressed while they are clamped between pair of holding blocks, so that they are electrically connected with each other by anisotropically conductive members

Circuit board device, wiring board connecting method, and circuit board module device

An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer, an electrical insulating base materialformed on the first wiring layerand including a via base holethat leads to the first wiring layer, and a second wiring layerthat is formed on the electrical insulating base materialand is electrically connected to the first wiring layerthrough the via base hole. In a region of the second wiring layerdisposed at least in the vicinity of the via base hole, a stress relieving portionis formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base materialis curved.

Printed circuit board and semiconductor package

Stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion is suppressed. In a flexible wiring board, insulation layers () and wiring layers () are piled up alternately and wiring layers () are via-connected each other. The board comprises reinforced area () reinforced against external stress, bending area () bending easier than the reinforced area () by external stress, and a stress relaxation area () provided in area between the reinforced area () and the bending area (), bending easier than the reinforced area () but not easier than the bending area () by the external stress, and relaxing the stress carried from the bending area () to the reinforced area ().

Wiring board, packaging board and electronic device

Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.

Semiconductor package, electronic part and electronic device

A color filter used in a color display device for displaying a color image by irradiating a color layer of the color filter with light includes a titanium dioxide layer having ultraviolet light shielding function formed in direct contact with the surface of the color layer at the upper side of the color layer in case that only the light incident on the color layer from the upper side of the color layer is prevented or an upper and lower titanium dioxide layers formed on and below the color layer in order to make the advantage being free from fading perfect. In the latter case, it is possible to restrict transmission of light having wavelength in the wavelength range of ultraviolet light to the color layer to thereby restrict direct decomposition of pigment molecules and obtain the advantage being free from fading, by directly covering the color filter with titanium dioxide at the upper side of the color layer and providing the lower titanium dioxide layer below the color layer.

Growing community of inventors

Tokyo, Japan

Atsumasa Sawada