Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Atsuhiro Yoshizaki

Keiichi Mashino

Hiromichi Anan

Yoshitaka Ochiai

Toshihiko Nakata

Sachio Uto

Yoshitada Oshida

Masataka Shiba

Hideyuki Nemoto

Yasutaka Hoshino

Tsutomu Fujisawa

One method of achieving the above subjects is by connecting a block member, which is connected to the side opposite to that of a semiconductor chiphaving insulating substratesandconnected to the top and bottom of the semiconductor chip, to a block memberacross an laminated structure constituted by the semiconductor chipand the insulating substratesand

Semiconductor module and power conversion device

One method of achieving the above subjects is by connecting one of electroconductive members, which are pre-connected to the top and bottom of a semiconductor chipand have thermal conductivity, to an electroconductive member, which is used with the semiconductor chipto constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive memberso as to straddle the laminated structure constituted by the semiconductor chipand the electroconductive member

According to the present invention, there are provided an input terminal, an output terminal, an a.c. generating circuit and a voltage-anomaly detecting circuit. Power supplied to the input terminal is outputted from the output terminal based on an output produced from the voltage-anomaly detecting circuit. When the voltage of the supplied power is abnormal, a.c. power produced from the a.c. generating circuit is outputted from the output terminal. Further, a boosting circuit, a rectifying circuit and a capacitor are provided. The a.c. generating circuit is constructed so as to produce a.c. power from a charged voltage of capacitor. Owing to this construction, a power supply apparatus having a function for compensating for changes in voltage can be provided which is small in size and is inexpensive.

Power supply apparatus having a function of compensating for changes in

An alignment method and apparatus for reduction projection type aligner in which the rough detection of reticle position in the reticle alignment process at the time of mounting a reticle and the fine detection of reticle position in the wafer alignment for the alignment between a wafer and the reticle are performed automatically by the same reticle alignment pattern and the same optical alignment detection system. A plurality of one- or two-dimensional Fresnel zone plates having different shapes of diffraction patterns formed outside of a reticle circuit pattern and arranged at a position outward of the entrance pupil of the reduction projection lens are used as a reticle alignment pattern to detect the absolute position of the reticle. The detection field of view of the optical alignment detection system is thus effectively widened to make pattern detection possible with high magnification for an improved detection accuracy. The same reticle alignment pattern and the same optical alignment detection system are used for rough detection of reticle position in reticle alignment and fine detection of reticle position in wafer alignment. In the optical alignment detection system, on the other hand, the image position of the diffraction pattern from the reticle alignment pattern and the image position of the wafer alignment pattern are located at the same distance from the reticle surface.

Alignment method and apparatus for reduction projection type aligner

A protective relay which carries out various relay functions by converting externally received AC data into time widths in accordance with protective ranges and determining whether or not the protective operations are necessary on the basis of the time widths. The protective relay receives a plurality of input AC data through a time-dividing device and converts the time-divided data into the time widths for the relay functions to determine the relay operations of the relay functions on the basis of the time widths.

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Hitachinaka, Japan

Atsuhiro Yoshizaki