Sony Corporation

J-devices Corporation

Other

Atsuhiro Uratsuji

Masanobu Yagi

Tatsutoshi Narita

Toshiyuki Inaoka

Yoshiyuki Ukeda

Yuichiro Yoshikawa

Katsushi Yoshimitsu

A manufacturing method of a semiconductor package includes locating, on a substrate, a semiconductor device having an external terminal provided on a top surface thereof, forming a resin insulating layer covering the semiconductor device, forming an opening, exposing the external terminal, in the resin insulating layer, performing plasma treatment on a bottom surface of the opening, performing chemical treatment on the bottom surface of the opening after the plasma treatment, and forming a conductive body to be connected with the external terminal exposed in the opening.

Manufacturing method of semiconductor package

An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.

Method for producing a semiconductor package

A multilayer wiring substrate, a method of producing and a semiconductor product includes: a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer; and a copper plating applied to the trench.

Multilayer wiring substrate, method of producing the same, and semiconductor product

Provided are a flex-rigid wiring board having an increased shielding effect and improved productivity with reduced number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible cable section () having a shielding layer () on an outer surface, and a rigid mounting section () having a wiring layer () provided on the same surface as the shielding layer (). The shielding layer () and the wiring layer () are made of a same sheet of continuous copper foil (). The wiring layer () is plated and is made thicker than the shielding layer (). A same continuous insulating layer () is provided on outer sides of the shielding layer () and the wiring layer () of the mounting section ().

Flex-rigid wiring board and method for manufacturing the same

A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unitfor etching landsformed on the printed wiring board, a rinsing unitfor rinsing the printed wiring board, a bubble removingfor removing air bubblesattached to the printed wiring boardon immersing the printed wiring boardin a water-soluble pre-flux liquidin a processing vessel, a pre-flux forming unitfor forming a pre-flux filmon the landsof the printed wiring boardin the pre-flux liquidusing an in-liquid spraying unit, a liquid removing unitfor removing the pre-flux liquidfrom the printed wiring boardtransported from the processing vesseland a rinsing unitfor rinsing the printed wiring board

Method and apparatus for surface processing of printed wiring board

A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unitfor etching landsformed on the printed wiring board, a rinsing unitfor rinsing the printed wiring board, a bubble removing unitfor removing air bubblesattached to the printed wiring boardon immersing the printed wiring boardin a water-soluble pre-flux liquidin a processing vessel, a pre-flux forming unitfor forming a pre-flux filmon the landsof the printed wiring boardin the pre-flux liquidusing an in-liquid spraying unit, a liquid removing unitfor removing the pre-flux liquidfrom the printed wiring boardtransported from the processing vesseland a rinsing unitfor rinsing the printed wiring board

A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit for etching lands formed on the printed wiring board , a rinsing unit for rinsing the printed wiring board , a bubble removing unit for removing air bubbles attached to the printed wiring board on immersing the printed wiring board in a water-soluble pre-flux liquid in a processing vessel , a pre-flux forming unit for forming a pre-flux film on the lands of the printed wiring board in the pre-flux liquid using an in-liquid spraying unit , a liquid removing unit for removing the pre-flux liquid from the printed wiring board transported from the processing vessel and a rinsing unit for rinsing the printed wiring board

Growing community of inventors

Ishikawa, Japan

Atsuhiro Uratsuji