Sony Computer Entertainment Inc.

Nippon Steel Corporation

Atsuhiko Imai

Iwao Takiguchi

Tetsuji Tamura

Kazuaki Yazawa

Kenichi Adachi

Masayuki Kasuya

Kazuaki Mitsui

Kazutoshi Iwami

Toru Utsumi

Takeshi Shinoda

In a power supply apparatus for supplying a target power supply voltage to a microprocessor, a system controller sets the target power supply voltage to be supplied to the microprocessor based on a voltage configuration signal outputted from the microprocessor and outputs a voltage setting signal corresponding to the target power supply voltage. The regulator circuit generates the target power supply voltage set by the system controller based on the voltage setting signal outputted from the system controller and supplies the voltage to the microprocessor. The system controller acquires the conditions of the microprocessor, such as the operating time and temperature of the microprocessor and the amount of computation in the microprocessor, and reflects the acquired conditions on the setting of the power supply voltage.

Power supply apparatus with system controller

This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.

Skipping non-time-critical task according to control table when operating frequency falls

A heat generation amount estimation unit acquires the number of sub processors currently in operation, acquires the current operating frequency, and estimates the amount of heat generation after a period &#x394;t. A temperature control unit estimates the temperature after the period &#x394;t based on the current temperature input from a temperature sensor and the amount of heat generation estimated, and compares it with a predetermined threshold temperature. If the predetermined threshold temperature is reached, the temperature control unit acquires the number of sub processors available in parallel after the period &#x394;t from a task management unit, and consults a performance table to determine which operation point to shift to. A sub processor control unit and a frequency control unit switch to the number of sub processors in operation and the operating frequency accordingly. The performance table lists possible operation points in order of performance.

Processor for controlling performance in accordance with a chip temperature, information processing apparatus, and method of controlling processor

A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots. An operating frequency control unit exercises control for lowering the operating frequency of the processor when the maximum temperature of the processor estimated by the temperature estimation unit exceeds a predetermined limit temperature.

Processor, processor system, temperature estimation device, information processing device, and temperature estimation method

A temperature predicting unit predicts the temperature of an electronic device after a predetermined period, and the speed of temperature variation from the operating state of the load. Based on the results of prediction by the temperature predicting unit, a selection unit instructs either one or both of a nozzle control unit and an electric fan control unit to exercise control. According to a control signal from the selection unit, the nozzle control unit transmits a control signal to a nozzle unit to drive a jet cooling apparatus. According to a control signal from the selection unit, the electric fan control unit transmits a control signal to an electric fan unit to drive an electric fan. The selection unit selects the electric fan when the predicted speed of temperature variation exceeds a predetermined threshold, and selects the jet cooling apparatus when the predetermined thresholds is not exceeded.

Electronic device cooling apparatus and method for cooling electronic device with temperature prediction

The present invention provides a method of manufacturing a honeycomb body () formed by winding a flat metal foil () and a corrugated metal foil () in layers and brazing them, capable of reducing the equipment cost of honeycomb body manufacturing facilities and conforming to the countermeasure against an engine misfire problem of the honeycomb body, without causing insufficient or excessive application of adhesive which is seen in the cases of adhesive application methods using rolls; and relates to a method of manufacturing a honeycomb body characterized by: applying an adhesive to the portions to be brazed of the flat or corrugated foil corresponding to a bonding portion () which is located at one or both ends of the honeycomb body and/or a bonding portion () inside the honeycomb body over a cross section which is located away from one or both ends thereof in the axial direction; then, winding the flat and corrugated foils in layers to form a honeycomb body; then, making the portion of one or both end faces of the honeycomb body corresponding to the bonding portion () over the full axial length of the honeycomb body outer layers contact the surface of a liquid binder and having the binder sucked up along contact lines () of the flat and corrugated foils; and, then, feeding a brazing filler metal in powder to the honeycomb body so as to have it deposited at the portions where the adhesive and binder have been deposited.

Growing community of inventors

Tokyo, Japan

Atsuhiko Imai