Smiths Detection Montreal, Inc.

Blackberry Corporation

Gennum Corporation

Paratek Microwave Incorporated

Atin J Patel

Mark Vandermeulen

Ivoyl Koutsaroff

Andrew V Cervin-Lawry

Igor Kubelik

Volodimir Bondarenko

Henryk Zaleski

Simon Feldberg

Douglas Jason Green

Mark Piniarski

Bohdan Atamanchuk

Qunzhou Bian

Vlad Sergeyev

Daniel Levin

Paul Christopher Peter Thomson

Robert E Hawke

Brian Boso

Andrew Vladimir Claude Cervin

Sukhminder S Binapal

Charles Divita

Lynn McNeil

Thomas G Fletcher

Paul Christopher Thomson

A trace analyte collection swab having a collection surface at least partially coated with a microscopically tacky substance to enhance pick-up efficiency is described. In embodiments, the truce analyte collection swab comprises a substrate including a surface having a trace analyte collection area and a coating disposed on the surface of the substrate in the trace analyte collection area. The coating is configured to be microscopically adhesive to collect particles of the trace analyte from a surface when the trace analyte collection area is placed against the surface. In one embodiment, the coating comprises Polyisobutylene.

Trace analyte collection swab

An ion detection assembly is described that includes a drift chamber, an inlet assembly, and a collector assembly. The drift chamber is formed of substantially non-conductive material and/or semi-conductive material. A patterned resistive trace is deposited on one or more of an interior surface or an exterior surface of the drift chamber. The patterned resistive trace is configured to connect to a source of electrical energy. The inlet assembly and the collector assembly are in fluid communication with the drift chamber. The inlet assembly includes an inlet for receiving a sample, a reaction region for ionizing the sample, and a gate for controlling entrance of the ionized sample to the drift chamber. The collector assembly includes a collector plate for collecting the ionized sample after the ionized sample passes through the drift chamber.

Ion mobility spectrometry (IMS) device with charged material transportation chamber

A trace analyte collection swab having a collection surface at least partially coated with a microscopically tacky substance to enhance pick-up efficiency is described. In embodiments, the trace analyte collection swab comprises a substrate including a surface having a trace analyte collection area and a coating disposed on the surface of the substrate in the trace analyte collection area. The coating is configured to be microscopically adhesive to collect particles of the trace analyte from a surface when the trace analyte collection area is placed against the surface. In one embodiment, the coating comprises Polyisobutylene.

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).

Method of forming a multi-level thin film capacitor

Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same

Multi-level thin film capacitor on a ceramic substrate

A multi-chip module (MCM) assembly has three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate. The back of the second IC layer may be glued to the back of the first IC layer, and the second and third IC layers are electrically flip-chip connected to each other. In one embodiment, the third IC layer is electrically connected to the substrate through a vertical interconnect element for high circuit density. In another, the second IC layer is electrically connected to the substrate using wire bonding for greater post-fabrication customization flexibility. In still another embodiment, the MCM assembly comprises two stacked IC layers where the second IC layer is electrically flip-chip connected to the first IC layer and the second layer is electrically connected to the substrate through a vertical interconnect element. By directly connecting IC layers, higher circuit density, lower trace impedance, and lower cross-talk or electrical noise susceptibility is achieved over that presently offered by most current MCM assemblies. The assembly accommodates different sized IC layers, multiple ICs on each layer, and different technology-based IC layers and ICs within each layer, providing the user with high design flexibility within a single multi-chip assembly.

Three dimensional packaging configuration for multi-chip module assembly

A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as the substrate, is added to the outside surface of the encapsulant. The purpose of the layer is to provide a second opposing surface to balance and thereby reduce the stress originating from the encapsulant/substrate interface. The second layer is applied prior to the curing of the encapsulant material.

Method and structure for balancing encapsulation stresses in a hybrid

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Mississauga, Canada

Atin J Patel