Japan Aviation Electronics Industry, Limited

Asuka Hosoda

Hiroshi Akimoto

Kazuhisa Saito

A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is poorly wettable to the weld brazing material on the base member, forms a finish plating layer of a material that is highly wettable to the weld brazing material on the primer plating layer, and selectively removes a portion of the finish plating layer to obtain an exposed region of the primer plating layer that serves as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable finish plating layer in brazing the terminal section to the brazing pad of a wiring board.

Method for manufacturing an electronic component

An electronic component is obtained by forming a primer plating layer of a material which is poorly wettable to a weld brazing material on a base member X of a contact having a terminal section for brazing and a contact section , and then forming a finish plating layer of a material which is highly wettable to the weld brazing material on the primer plating layer. An exposed region of the poorly wettable primer plating layer is formed thereafter by selectively removing a portion of the finish plating layer at the terminal section and served as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable plating layer in brazing the terminal section to the brazing pad of a wiring board

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Tokyo, Japan

Asuka Hosoda