Stmicroelectronics (grenoble 2) Sas

Asma Hajji

Fabien Quercia

David Auchere

Jerome Lopez

Younes Boutaleb

Ouafa Hajji

Jérôme Lopez

A support substrate supports an electronic chip. An encapsulation coating on the support substrate coats the electronic chip. The encapsulation coating includes a trench surrounding the electronic chip. A heat sink is mounted to the encapsulation coating above the electronic chip. The heat sink is fixed to the encapsulation coating by an adhesive material and a thermal interface material layer is present between the electronic chip and the heat sink. The trench is positioned between the thermal interface material layer and the adhesive material.

Integrated circuit package with heat sink and manufacturing method thereof

An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device

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Voiron, France

Asma Hajji