Osram Opto Semiconductors Gmbh

Asliza Alias

Tomin Liu

Wing Yew Wong

Hui Chiang Teoh

Hui Ying Pee

Mei See Boon

Yuan Liang

Alex Kheng Hooi Lim

Lay Sin Khoo

Lay Teng Tan

In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

An optoelectronic semiconductor device and a method for forming an optoelectronic semiconductor device are disclosed. In an embodiment a device includes a carrier having a main plane of extension, at least one semiconductor chip arranged on the carrier, a frame arranged on the carrier and surrounding the semiconductor chip in lateral directions which are parallel to the main plane of extension of the carrier and a conversion layer covering the at least one semiconductor chip and the frame, wherein the at least one semiconductor chip extends further in a vertical direction than the frame, wherein the semiconductor chip is configured to emit electromagnetic radiation, and wherein the frame and the semiconductor chip are spaced from each other in the lateral directions by a gap.

Optoelectronic semiconductor device and method for forming an optoelectronic semiconductor device

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Georgetown, Malaysia

Asliza Alias