Advanced Micro Devices Corporation

Aslam Yehia

Suresh Ramalingam

Chi-Yi Chao

Gamal Refai-ahmed

Md Malekkul Islam

Hoa Do

An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.

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San Jose, CA, United States of America

Aslam Yehia