Kernforschungszentrum Karlsruhe Gmbh

Kernforschungszentrum Kalrsruhe Gmbh

Asim Maner

Wolfgang Ehrfeld

Dietrich Munchmeyer

Klaus Schubert

Wilhelm Bier

Erwin W Becker

Peter Hagmann

Jurgen Mohr

The invention relates to a process for producing a two-dimensionally extending metallic microstructure body having a multitude of minute openings the dimensions and distribution of which may be predetermined. A tool having microstructures on the surface thereof, which microstructures taper outwardly, is pressed into the electrically insulating layer of a molding material comprising an electrically insulating layer and an electrically conducting layer, so that the microstructures project at least through the insulating layer, to form an impression in the molding material. The tool is withdrawn from the molding material to form an impression in the molding material comprised of openings which taper in the direction of the electrically conducting layer. The impression of the molding material is electroplated with a metal to fill the openings with metal to form a two-dimensionally extending metallic microstructure having adjacent metal fillings and minute openings, by filling the openings in the impression to a height at which the distance between adjacent fillings corresponds at the surface of the fillings to the predetermined dimensions of the two-dimensionally extending metallic microstructure. The molding material is removed from the two-dimensionally extending metallic microstructure.

Process for producing a two-dimensionally extending metallic

A process for the lithographic manufacture of electroformable microstructure having a triangular or trapezoidal cross-section from a resist material. A composite body is provided which is comprised of a layer of resist material on an electrically conductive substrate. The resist layer is irradiated to form irradiated band regions in the resist layer by conducting a first irradiation in which the substrate having the resist layer thereon is positioned at an angle of +.alpha. relative to a plane orthogonal to the incident radiation to form a first set of band-shaped regions, and a second irradiation in which the substrate is positioned at an angle of -.alpha. relative to a plane orthogonal to the incident radiation to form a second set of band-shaped regions which overlap the first set at the interface between the resist layer and the substrate. The irradiated regions of the resist layer are developed to produce microstructures.

Process for the lithographic manufacture of electroformable

A process for reproducing a structured, plate-shaped body, comprising the steps of: (a) providing a composite body containing an electrically insulating molding compound layer and an electrically conducting molding compound layer, (b) pressing a first microstructured body, having an outer face, into the electrically insulating molding compound layer while applying ultrasound so that the outer face of the first microstructured body projects into the electrically conducting layer, (c) removing the first microstructured body from the composite body while applying ultrasound to form an impression in the composite body, (d) electroplating a metal into the impression in the composite body to fill the impression with metal and form a second microstructured body, and (e) removing the composite body from the second microstructured body.

Process for the reproduction of a microstructured, plate-shaped body

A method for producing a mask for deep-etch x-ray lithography in which the mask pattern of a thin-film mask having thin absorber structures is transferred by recopying with soft X-ray radiation to an X-ray resist layer whose layer thickness corresponds to the thickness of the absorber structures of the mask to be subsequently produced. Transfer errors during recopying are avoided by producing the thin-film mask directly on one side of a carrier membrane; applying a positive X-ray resist layer on the other side of the carrier membrane; irradiating the positive X-ray resist layer with approximately parallel X-ray radiation through the thin-film mask to produce irradiated portions in the positive X-ray resist layer; removing the irradiated portions of the positive X-ray resist layer to expose portions of the carrier membrane; electrolytically depositing elements having a high atomic number, e.g., heavy metals, onto the exposed portions of the carrier membrane, removing the remaining resist material and etching away the thin-film mask.

Method for producing deep-etch, X-ray lithography masks

In order to produce a plurality of plate shaped metal bodies containing a microstructure from a single molding tool constituting a master for the bodies, a negative mold is formed by filling the recesses in the microstructure of the tool with electrically insulating material and fastening to the insulating material an electrically conductive material which contacts the end faces of the microstructure of the tool.

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Linkenheim, Germany

Asim Maner