Lam Research Corporation

Airwatch LLC

Novellus Systems Incorporated

Ashwin Ramesh

Shantinath Ghongadi

Zhian He

Jingbin Feng

Robert Marshall Stowell

Shiva Subbha Ram

Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contact element disposed on the elastomeric sealing element. The main body portion may be such that it does not substantially flex when a substrate is pressed against the moment arm, and it may be rigidly affixed to another feature of the cup structure. The ratio of the average vertical thickness of the main body portion to that of the moment arm may be greater than about 5. The electrical contact element may have a substantially flat but flexible contact portion disposed upon a substantially horizontal portion of the sealing element. The elastomeric sealing element may be integrated with the cup bottom element during manufacturing.

Lipseals and contact elements for semiconductor electroplating apparatuses

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

Control of current density in an electroplating apparatus

Disclosed are various examples for client device migration. A web application is generated to migrate a client device from a first management service to a second management service. A request to migrate the client device from the first management service to the second management service is identified through the web application. An un-enrollment request is transmitted to un-enroll the client device from the first management service. An enrollment link is received, for the client device to enroll with the second management service. The web application redirects the client device to complete an enrollment of the client device with the second management service using the enrollment link.

Management service migration using web applications

Disclosed are various examples for client device migration. In one example, a client device is enrolled with a first management service. A user interface is generated that identifies a user request to enroll the client device with a second management service. An un-enrollment from the first management service is initiated. The un-enrollment from the first management service is initiated using an identifier of the client device. An enrollment with the second management service is initiated. The enrollment with the second management service is initiated using the identifier of the client device.

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Beaverton, OR, United States of America

Ashwin Ramesh