Honeywell International Inc.

Ashutosh Kumar Pandey

ShanoPrasad Kunjappan

Shridhara Shanbhogue

Ramkrishna U Pal

ArulSelvam Arumugam

Dathathreya Durgadhahalli Ganesh

In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation.

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Bengaluru, India

Ashutosh Kumar Pandey