General Electric Company

Analyttica Datalab Inc.

Ashutosh Joshi

Joseph James Lacey

Ljubisa Dragoljub Stevanovic

William Edward Burdick, Jr

Garron Koch Morris

Kamlesh Mundra

Didier G Rouaud

Sandeep Shrikant Tonapi

Janos Gyorgy Sarkozi

Halasya Siva Subramania

Joe James Lacey

Rajiv Baphna

Satyamoy Chatterjee

James Wilson Rose

Nicholas Ryan Konkle

Jonathan David Short

Jun Guo

Mark A Kappel

Mayank Gupta

Xiaoyan Zhang

Russell Wayne Hum

Venkatarao Ryali

Zhuo Liu

Medy Satria

Oliver Richard Astley

Hailiang Liu

Timothy Patrick Rose

Sanketh Bhat

Apparatuses, systems, methods, and computer program products are disclosed for adaptive machine learning. An apparatus includes a monitoring module that continuously monitors one or more interactions of a user while the user performs one or more simulated tasks digitally presented to the user that are associated with a learning path. The apparatus includes a metadata module that tracks data describing the user's interactions during the user's performance of one or more simulated tasks. The apparatus includes a machine learning module that, dynamically and in real-time, optimizes the user's learning path by simulating multiple different learning paths using one or more machine learning processes and tracked data. The apparatus includes a recommendation module that presents one or more recommendations to the user for optimizing the user's learning path. One or more recommendations may be generated as a function of the optimized learning path.

Adaptive machine learning system

A processor implemented method for scoring a challenge taken by a user, and training the user using a simulation based learning platform is provided. The processor implemented method includes (i) obtaining, from a database, challenges to be taken by a user and associated at least one of information, (iii) processing a selection of, the challenge from the challenges with actions or steps performed by the user, (iv) rendering, hints to solve the challenge, (v) recording, steps taken by the user to solve the challenge, (vi) comparing the steps taken by the user with steps taken by an expert to solve the challenge to compute a deviance of the user from a reference path, (vii) scoring, the challenge based on the deviance of the user from the reference path to obtain a score, and (viii) notifying, a result associated with the challenge to the user based on the score.

Simulation based learning system and method for training and scoring one or more challenges taken by a user

In one embodiment, a system for thermal management in a CT device comprises first and second thermal management zones, each comprising an x-ray detector, at least one variable speed fan proximate to the x-ray detector, an air temperature sensor positioned to measure an air temperature of the intake air to the variable speed fan, a rail heater in thermal contact with the x-ray detector, a rail temperature sensor in thermal contact with the rail heater to measure a rail temperature, and a controller that controls the variable speed fan as a function of at least the air temperature and the rail heater as a function of the rail temperature to maintain a temperature of the x-ray detector within a predetermined range.

System and method for thermal management of a CT detector

A CT system includes a rotatable gantry having an opening for receiving an object to be scanned, an x-ray source configured to project x-rays through the opening, and a detector assembly positioned to receive the x-rays. The detector assembly includes a plurality of readout chips positioned within a cooling zone and configured to receive electrical signals from a plurality of diode arrays, and a fan positioned to blow air into the cooling zone. An air temperature within the cooling zone is controlled independent of a speed of the fan.

Method and apparatus for thermal control in a CT detector

A data acquired system is provided. The data acquired system includes a main structure with a cavity formed therein, the cavity having a bottom for mounting a circuit board with electrical components thereto, a fan assembly disposed on the main structure, and an airflow guide disposed within the cavity and configured to guide airflow from the fan assembly for heat dissipation of the electrical components, the airflow guide positioned at a distance above the electrical components to form a gap between the airflow guide and the electrical components, wherein a sidewall of the cavity is provided with an air vent corresponding to the gap such that the airflow passes through the gap and is discharged from the air vent.

Data acquired system and CT apparatus using the same

A liquid cooled thermal control system for a computed tomography (CT) detector includes a plurality of temperature sensors and a control mode selector module coupled to the plurality of temperature sensors. The control mode selector module is programmed to receive an input from the plurality of temperature sensors, identify the inputs as either valid inputs or invalid inputs, and determine an operational mode of the liquid cooled thermal control system based on the identified inputs. A CT imaging system and a method of operating a cooling system are also described.

Liquid cooled thermal control system for an imaging detector

A method is provided for image detection. The method includes measuring a temperature of an analog-to-digital (A/D) converter of an imaging system during an imaging scan of an object, and correcting a gain of the A/D converter based on the measured temperature of the A/D converter.

Methods and systems for image detection

A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a variety of insulative, radiative, conductive, and convective heat distribution techniques. For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

Integral ballast lamp thermal management method and apparatus

An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

Interface assembly for thermally coupling a data acquisition system to a sensor array

A computed tomography detector apparatus includes a substrate defining a recessed area. The computed tomography detector apparatus includes a heat pipe at least partially disposed within the recessed area. The computed tomography detector apparatus also includes an electronic component attached to the substrate.

Computed tomography detector apparatus

A method includes thermally stabilizing a Computed Tomography (CT) detector module.

Thermal stabilization methods and apparatus

A method includes controlling a PET detector temperature at a constant temperature.

PET detector methods and apparatus

A heat management apparatus for disposition in a medical imaging system is disclosed. The apparatus includes a thermally conductive detector module, sensor components disposed upon the detector module, and signal processing electronics in thermal communication with the detector module, the signal processing electronics disposed proximate the sensor components. A main heat conductor is in thermal communication with a first defined portion of a length of the detector module, and a local heat conductor is in thermal communication with a second defined portion of the length of the detector module.

System and apparatus for heat management

A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

Disclosed herein is a method for assembly of Computed Tomography (CT) Detector electronic circuits. A thermally conductive adhesive is dispensed on a first side of a first circuit board, the first circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the first circuit board. The thermally conductive adhesive is also dispensed on a first side of a second circuit board, the second circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the second circuit board. A first heat sink is mounted to the first side of the first circuit board. A second heat sink mounted to the first side of the second circuit board. The adhesive is cured on the first and the second circuit boards. The first circuit board is attached to the second circuit board, wherein the second side of the first circuit board is adjacent to the second side of the second circuit board.

Growing community of inventors

Waukesha, WI, United States of America

Ashutosh Joshi