Cisco Technology, Inc.

Ashley J Maker

Matthew Joseph Traverso

Jock T Bovington

Sandeep Razdan

Vipulkumar K Patel

Kumar Satya Harinadh Potluri

Mark Andrew Webster

Anthony D Kopinetz

Aparna R Prasad

Joyce J M Peternel

Jarrett S Neiman

An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a mold compound; a photonic integrated circuit (PIC) embedded in the mold compound, that has a face exposed from the mold compound in a first plane; an interposer embedded in the mold compound, that has a face exposed from the mold compound in the first plane (i.e., co-planar with the exposed face of the PIC); and an electrical integrated circuit (EIC) coupled to the exposed face of the PIC and the exposed face of the interposer, that establishes bridging electrical connections between the PIC and the interposer.

Integrated circuit bridge for photonics and electrical chip integration

A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.

Fiber coupler with an optical window

By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips

A method of manufacturing an optical apparatus comprises forming an unfinished endface of a fiber array unit (FAU) that provides an arrangement of one or more optical fibers. The one or more optical fibers terminate at the unfinished endface. The method further comprises optically aligning the FAU with an external light-carrying medium. The one or more optical fibers are optically coupled with the external light-carrying medium through the unfinished endface.

Fiber array unit with unfinished endface

The present disclosure provides for periscope optical assemblies within interposers that include a bulk material having a first side and a second side opposite to the first side; a first optic defined in the bulk material at a first height in the bulk material along an axis extending between the first second sides; a second optic defined in the bulk material at a second height in the bulk material, different than the first height, along the axis; a first waveguide defined in the bulk material, extending from the first side to the first optic; a second waveguide defined in the bulk material, extending from the second optic to the second side; and a third waveguide defined in the bulk material, extending from the first optic to the second optic.

Periscope optical assembly

An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.

Connection features for electronic and optical packaging

Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.

Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.

Passive fiber to chip coupling using post-assembly laser patterned waveguides

An apparatus comprises a plurality of optical fibers and a lid member having one or more surfaces with grooves formed therein. The lid member defines a first plurality of grooves that are each dimensioned to partly receive an optical fiber of the plurality of optical fibers. The apparatus further comprises a substrate comprising a plurality of waveguides arranged at a predefined depth relative to a reference surface of the substrate, and a plurality of ribs extending from the reference surface. Each rib of the plurality of ribs is dimensioned to engage with a respective groove of a second plurality of grooves of the lid member. Engaging the plurality of ribs of the substrate with the second plurality of grooves of the lid member provides an optical alignment of the plurality of optical fibers with the plurality of waveguides.

Fiber to chip alignment using passive vgroove structures

Aspects described herein include a method comprising forming an insulator layer above a silicon layer of a silicon-on-insulator (SOI) substrate. A first optical device is formed partly in the silicon layer and partly in the insulator layer. A first optical waveguide is formed in the insulator layer and optically coupled with the first optical device. The method further comprises forming conductive contacts extending partly through the insulator layer to the first optical device, bonding a first surface of an interposer with a top surface of the insulator layer, and forming, from a second surface of the interposer opposite the first surface, a plurality of first conductive vias extending at least partly through the interposer. The plurality of first conductive vias are coupled with the conductive contacts.

Photonic integrated circuit bonded with interposer

A submount assembly comprises a first substrate having a first surface and an opposing second surface, wherein a plurality of first grooves are formed into the first substrate from the first surface. Each first groove is dimensioned to receive a portion of a respective optical fiber of a plurality of optical fibers, and to arrange the optical fiber with a predetermined first height relative to the first surface. The submount assembly further comprises a plurality of first conductive traces on a side of the first substrate corresponding to the first surface, and a semiconductor laser contacted with the first conductive traces. The semiconductor laser has a predetermined second height relative to the first surface. The submount assembly further comprises a plurality of second conductive traces at the second surface and a plurality of first vias extending through the first substrate from the first conductive traces to the second conductive traces.

Submount for semiconductor laser and optical fibers

Embodiments herein describe a fiber array unit (FAU) configured to couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into a non-transparent layer that overlap with epoxy wells in the photonic chip. Moreover, the FAU may include a transparent substrate on which the non-transparent layer is disposed that permits UV light to pass therethrough. As such, during curing, UV light can be pass through the transparent substrate and through the optical windows in the non-transparent layer to cure the epoxy disposed between the FAU and the photonic chip.

Growing community of inventors

Pleasanton, CA, United States of America

Ashley J Maker