Intel Corporation

Sk Hynix Nand Product Solutions Corp.

Ashish Verma Penumatcha

Uygar E Avci

Chia-Ching Lin

Ian A Young

Tanay Gosavi

Shriram Shivaraman

Kirby Maxey

Seung Hoon Sung

Carl H Naylor

Chelsey Dorow

Jack T Kavalieros

Sou-Chi Chang

Sudarat Lee

Matthew V Metz

Nazila Haratipour

Kevin P O'brien

Kevin O'Brien

Raseong Kim

Owen Y Loh

I-Cheng Tung

Devin Merrill

Scott Bruce Clendenning

Dmitri E Nikonov

Kaan Oguz

Daniel Henry Morris

Tristan A Tronic

Punyashloka Debashis

Mengcheng Lu

Marko Radosavljevic

Seiyon Kim

Urusa Alaan

Arnab Sen Gupta

Hai Li

Patrick Theofanis

Tobias Brown-Heft

Aditya Kasukurti

Eric Charles Mattson

Uygar Avci

Owen Loh

Kevin Obrien

A memory device, an integrated circuit component including an array of the memory devices, and an integrated device assembly including the integrated circuit component. The memory devices includes a first electrode; a second electrode including an antiferromagnetic (AFM) material; and a memory stack including: a first layer adjacent the second electrode and including a multilayer stack of adjacent layers comprising ferromagnetic materials; a second layer adjacent the first layer; and a third layer adjacent the second layer at one side thereof, and adjacent the first electrode at another side thereof, the second layer between the first layer and the third layer, the third layer including a ferromagnetic material. The memory device may correspond to a magnetic tunnel junction (MTJ) magnetic random access memory bit cell, and the memory stack may correspond to a MTJ device.

Differentially programmable magnetic tunnel junction device and system including same

Thin film transistors having strain-inducing structures integrated with two-dimensional (2D) channel materials are described. In an example, an integrated circuit structure includes a two-dimensional (2D) material layer above a substrate. A gate stack is on the 2D material layer, the gate stack having a first side opposite a second side. A first gate spacer is on the 2D material layer and adjacent to the first side of the gate stack. A second gate spacer is on the 2D material layer and adjacent to the second side of the gate stack. The first gate spacer and the second gate spacer induce a strain on the 2D material layer. A first conductive structure is on the 2D material layer and adjacent to the first gate spacer. A second conductive structure is on the 2D material layer and adjacent to the second gate spacer.

Thin film transistors having strain-inducing structures integrated with 2D channel materials

A pbit device, in one embodiment, includes a first field-effect transistor (FET) that includes a source region, a drain region, a source electrode on the source region, a drain electrode on the drain region, a channel region between the source and drain regions, a dielectric layer on a surface over the channel region, an electrode layer above the dielectric layer, and a ferroelectric (FE) material layer between the dielectric layer and the electrode layer. The pbit device also includes a second FET comprising a source electrode, a drain electrode, and a gate electrode. The drain electrode of the second FET is connected to the drain electrode of the first FET.

Probabilistic computing devices based on stochastic switching in a ferroelectric field-effect transistor

A transistor includes a channel layer including a transition metal dichalcogenide (TMD) material, an encapsulation layer on a first portion of the channel layer, a gate electrode above the encapsulation layer, a gate dielectric layer between the gate electrode and the encapsulation layer. The transistor further includes a source contact on a second portion of the channel layer and a drain contact on a third portion of the channel layer, where the gate structure is between drain contact and the source contact.

Encapsulation for transition metal dichalcogenide nanosheet transistor and methods of fabrication

Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment, a semiconductor device comprises a first transistor on a first level, and a second transistor on a second level above the first level. In an embodiment, an insulating layer is between the first level and the second level, and a via passes through the insulating layer, and electrically couples the first transistor to the second transistor. In an embodiment, the first transistor and the second transistor comprise a first channel, and a second channel over the first channel. In an embodiment, the first second transistor further comprise a gate structure between the first channel and the second channel, a source contact on a first end of the first channel and the second channel, and a drain contact on a second end of the first channel and the second channel.

Stacked 2D CMOS with inter metal layers

Embodiments of the disclosure are directed to advanced integrated circuit (IC) structure fabrication and, in particular, to IC structures with graphene contacts. Other embodiments may be disclosed or claimed.

Integrated circuit structures with graphene contacts

Transistors, devices, systems, and methods are discussed related to transistors including a number of 2D material channel layers and source and drain control electrodes coupled to source and drain control regions of the 2D material channels. The source and drain control electrodes are on opposite sides of a gate electrode, which controls a channel region of the 2D material channels. The source and drain control electrodes provide for reduced contact resistance of the transistor, the ability to create complex logic gates, and other advantages.

Contact gating for 2D field effect transistors

Disclosed herein are transistors including two-dimensional materials, as well as related methods and devices. In some embodiments, a transistor may include a first two-dimensional channel material and a second two-dimensional source/drain (S/D) material in a source/drain (S/D), and the first two-dimensional material and the second two-dimensional material may have different compositions or thicknesses. In some embodiments, a transistor may include a first two-dimensional material in a channel and a second two-dimensional material in a source/drain (S/D), wherein the first two-dimensional material is a single-crystal material, and the second two-dimensional material is a single-crystal material.

Transistors including two-dimensional materials

A complementary metal oxide semiconductor (CMOS) transistor includes a first transistor with a first gate dielectric layer above a first channel, where the first gate dielectric layer includes HfZO, where 0.33<x<0.5. The first transistor further includes a first gate electrode on the first gate dielectric layer and a first source region and a first drain region on opposite sides of the first gate electrode. The CMOS transistor further includes a second transistor adjacent to the first transistor. The second transistor includes a second gate dielectric layer above a second channel, where the second gate dielectric layer includes HfZO, where 0.5<x<0.99, a second gate electrode on the second gate dielectric layer and a second source region and a second drain region on opposite sides of the second gate electrode.

Gate dielectrics for complementary metal oxide semiconductors transistors and methods of fabrication

Embodiments disclosed herein comprise semiconductor devices with two dimensional (2D) semiconductor channels and methods of forming such devices. In an embodiment, the semiconductor device comprises a source contact and a drain contact. In an embodiment, a 2D semiconductor channel is between the source contact and the drain contact. In an embodiment, the 2D semiconductor channel is a shell.

TMD inverted nanowire integration

Transistor structures with monocrystalline metal chalcogenide channel materials are formed from a plurality of template regions patterned over a substrate. A crystal of metal chalcogenide may be preferentially grown from a template region and the metal chalcogenide crystals then patterned into the channel region of a transistor. The template regions may be formed by nanometer-dimensioned patterning of a metal precursor, a growth promoter, a growth inhibitor, or a defected region. A metal precursor may be a metal oxide suitable, which is chalcogenated when exposed to a chalcogen precursor at elevated temperature, for example in a chemical vapor deposition process.

Transistors with monocrystalline metal chalcogenide channel materials

A transistor includes a first channel layer over a second channel layer, where the first and the second channel layers include a monocrystalline transition metal dichalcogenide (TMD). The transistor structure further includes a source structure coupled to a first end of the first and second channel layers, a drain structure coupled to a second end of the first and second channel layers, a gate structure between the source material and the drain material, and between the first channel layer and the second channel layer. The transistor further includes a spacer laterally between the gate structure and the and the source structure and between the gate structure and the drain structure. A liner is between the spacer and the gate structure. The liner is in contact with the first channel layer and the second channel layer and extends between the gate structure and the respective source structure and the drain structure.

Transition metal dichalcogenide nanosheet transistors and methods of fabrication

Disclosed herein are capacitors including built-in electric fields, as well as related devices and assemblies. In some embodiments, a capacitor may include a top electrode region, a bottom electrode region, and a dielectric region between and in contact with the top electrode region and the bottom electrode region, wherein the dielectric region includes a perovskite material, and the top electrode region has a different material structure than the bottom electrode region.

Capacitors with built-in electric fields

A transistor structure includes a first channel layer over a second channel layer, where the first and the second channel layers include a monocrystalline transition metal dichalcogenide (TMD). The transistor structure further includes a source material coupled to a first end of the first and second channel layers, a drain material coupled to a second end of the first and second channel layers, a gate electrode between the source material and the drain material, and between the first channel layer and the second channel layer and a gate dielectric between the gate electrode and each of the first channel layer and the second channel layer.

Transition metal dichalcogenide nanowires and methods of fabrication

A memory device structure includes a transistor structure including a gate electrode over a top surface of a fin and adjacent to a sidewall of the fin, a source structure coupled to a first region of the fin and a drain structure coupled to a second region of the fin, where the gate electrode is between the first and the second region. A gate dielectric layer is between the fin and the gate electrode. The memory device structure further includes a capacitor coupled with the transistor structure, the capacitor includes the gate electrode, a ferroelectric layer on a substantially planar uppermost surface of the gate electrode and a word line on the ferroelectric layer.

Growing community of inventors

Hillsboro, OR, United States of America

Ashish Verma Penumatcha