Applied Materials, Inc.

Ashish Shah

Juan Carlos Rocha-Alvarez

Thomas E Nowak

Sanjeev Baluja

Amir Hamed Al-Bayati

Dale R Dubois

Inna Shmurun

Andrzei Kaszuba

Takashi Shimizu

Ganesh Balasubramanian

Visweswaren Sivaramakrishnan

Hichem M'Saad

Karthik Janakiraman

Alexandros T Demos

Jianhua Zhou

Mohamad A Ayoub

Mark A Fodor

Chiu Chan

Khaled A Elsheref

Joseph C Werner

Lester A D'Cruz

Eui Kyoon Kim

Naoyuki Iwasaki

Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

Apparatus and method for exposing a substrate to UV radiation using a reflector having both elliptical and parabolic reflective sections

Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Systems for plasma enhanced chemical vapor deposition and bevel edge etching

Methods and apparatus for electron beam treatment of a substrate are provided. An electron beam apparatus that includes a vacuum chamber, at least one thermocouple assembly in communication with the vacuum chamber, a heating device in communication with the vacuum chamber, and combinations thereof are provided. In one embodiment, the vacuum chamber comprises an electron source wherein the electron source comprises a cathode connected to a high voltage source, an anode connected to a low voltage source, and a substrate support. In another embodiment, the vacuum chamber comprises a grid located between the anode and the substrate support. In one embodiment the heating device comprises a first parallel light array and a second light array positioned such that the first parallel light array and the second light array intersect. In one embodiment the thermocouple assembly comprises a temperature sensor made of aluminum nitride.

Vacuum reaction chamber with x-lamp heater

Growing community of inventors

Santa Clara, CA, United States of America

Ashish Shah