Intel Corporation

Ashish Dhall

Rahul N Manepalli

Kyu Oh Lee

Rahul Jain

Amruthavalli Pallavi Alur

Sai Vadlamani

Wei-Lun Kane Jen

Siddharth K Alur

Vipul V Mehta

Sri Chaitra J Chavali

Suriyakala Ramalingam

Robert F Cheney

An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Package with underfill containment barrier

A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

Method for forming an electrical device and electrical devices

Growing community of inventors

Chandler, AZ, United States of America

Ashish Dhall