Stora Enso Oyj

Ashar Zafar

Jesper Ekström

Dimitri Areskogh

Ben Nasli Bakir

Jesper Ekstrom

Staffan Torssell

Li Jansson

Huynh Tram Anh Pham

Lars Hjelm

The present invention relates to an improved process for preparing an aqueous dispersion of lignin and the use of said suspension in the preparation of a resin.

Process for preparing a resin

The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali and phenol. The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.

Process for preparing a solution of lignin in an aqueous medium

The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.

Process for preparing a bonding resin

The present invention relates to a liquid lignin composition, particularly useful in the manufacture of resins for products such as insulation, laminates and engineered wood products such as oriented strand boards (OSB). The liquid lignin composition has a low viscosity even at low water content.

Liquid lignin composition comprising lignin, water, alkali and urea

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxy propylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated vencer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.

Use of bonding resin

The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products. The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol-formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL). The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

Adhesive formulation comprising lignin

The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali. The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.

The present invention relates to a lignin-based phenolic resin, particularly useful in the manufacture of oriented strand boards (OSB).

Lignin-based phenolic resin

The present invention relates to a method for increasing the reactivity of lignin which method comprises the following steps; providing a mixture comprising lignin and an alkali solution wherein the concentration of the alkali solution of the mixture is between 5-50% by weight, storing said mixture for a period of at least 1 day whereby the reactivity of the lignin is increased. The present invention also relates to a resin composition comprising said lignin and use of said resin composition.

Method for increasing the reacitivity of lignin, and a resin composition comprising said lignin

The present invention relates to an activated lignin composition, its manufacture and its use thereof. It also relates to a resin comprising lignin, its manufacture and use.

Activated lignin composition, a method for the manufacturing thereof and use thereof

The present invention relates to a liquid lignin mixture comprising 3-50 wt % methanol, 12-50 wt % lignin and 5-85 wt % aqueous alkali solution wherein the concentration of said aqueous alkali solution is 1 to 50 wt % of alkali in water, based on the weight of said alkali solution prior to mixing with the other components of the mixture. The liquid lignin mixture can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.

Liquid lignin composition, lignin-based resin, and method of increasing the solubility of lignin

The present invention relates to a composition for coating, in particular a composition comprising lignin and one or more epoxy-group containing compounds, and methods for the manufacturing thereof and uses thereof. The present invention also relates to products obtainable by said methods and uses thereof.

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Årsta, Sweden

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