Matsushita Electric Industrial Co., Ltd.

Asao Iguchi

Takashi Suzuki

Isao Muragishi

Takashi Kanehisa

Mitsuhiro Abe

Nakanishi Itsuto

Tetuo Hori

Ariyoshi Hideho

A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are arranged at opposing surfaces of the molds and symmetrically formed with respect to a parting face of the mold tool to connect with the cavities. A method for forming the component includes the steps of inserting the supporting member with the chip in the cavities of the molds of the mold tool, clamping the molds, injecting molten resin into the cavities of the clamped molds through the upper and lower gates, cooling the molten resin in the cavities, and separating the molds from each other and removing the component from the cavities. The supporting member has a recess where the chip is located, and the recess has such a depth that a distance between an upper surface of the chip located in the recess and an upper surface of the package is substantially equal to a distance between a lower surface of a portion where the recess is formed and a lower surface of the package. A lead frame is one of the supporting member and includes a cutout formed at a portion corresponding to the gates, which are connected to each other through the cutout.

Mold tool assembly

A method and apparatus for joining flat-plate electrodes wherein a spacer, to which a joining material such as a low-melting-point crystallized glass containing a crystallization promoting agent is applied, is interposed between the electrodes to be joined. The electrodes and spacer are placed and held between upper and lower attraction dies. The upper and lower attraction dies are placed between upper and lower heating blocks for heating and pressing the electrodes and spacer through the attraction dies to join the electrodes via molten joining material.

Method of joining flat-plate electrodes

Growing community of inventors

Hirakata, Japan

Asao Iguchi