Dai Nippon Printing Co., Ltd.

Asako Narita

Chiaki Hatsuta

Chikao Ikenaga

Hiroki Oka

Sachiyo Matsuura

Shogo Endo

Katsunari Obata

Hiroshi Kawasaki

Yoshinori Hirobe

Yasuko Sone

Hitoshi Ishiro

A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied: (1) The number of the particles having an equivalent circle diameter of 1 &#x3bc;m or more is 50 or more and 3000 or less per 1 mmin the sample, and (2) The number of the particles having an equivalent circle diameter of 3 &#x3bc;m or more is 50 or less per 1 mmin the sample.

Metal plate for manufacturing deposition mask, method for manufacturing metal plate, deposition mask and method for manufacturing deposition mask

A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied:

Method for manufacturing metal plate

A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 &#x3bc;m.

Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, vapor deposition pattern forming method, and method for producing organic semiconductor element

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Tokyo, Japan

Asako Narita