Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Asako Baba

Kimiya Ikushima

Hiroyoshi Komobuchi

Mikiya Uchida

Yoshinori Takeuchi

Shinichi Wakabayashi

Hideo Kawai

Hitomi Moriya

In the present invention, an etching holeis formed in a polysilicon filmas a cavity-wall member. Through the etching hole, hydrofluoric acid is injected, so as to dissolve a silicon oxide film, thereby forming a cavity. In the cavity, a detecting unitof a sensor is in an exposed condition. Next, by sputtering, an Al filmis deposited in the etching holeand on an upper face of a substrate. Thereafter, a portion of the Al filmpositioned on the polysilicon filmis removed by etching back, thereby leaving only a metal closureof Al which closes the etching hole. The sputtering step is performed under a pressure of 5 Pa or less, so that the pressure in the cavity can be held to be low.

Electronic device and method of manufacturing the same

An electronic device according to the present invention includes: at least one heat sensing section (), which includes a first contact portion () and of which a physical property varies responsive to an incoming infrared ray; a detector circuit section, which includes a second contact portion () and which senses the variation in the physical property of the heat sensing section (); and a driving section (), which is able to change a first state, in which the first and second contact portions () are in contact with each other and electrically connected to each other, into a second state, in which the first and second contact portions () are out of contact with each other and electrically disconnected from each other, and vice versa.

Electronic device and method for fabricating the same

An electronic device according to the present invention includes: a cavity, which is surrounded with a cavity wall portion and which has a reduced pressure; a gettering thin film, which is arranged in the cavity and has the function of adsorbing a surrounding substance; and an activating portion, at least a part of which is arranged in the cavity and which has the function of activating the gettering thin film by generating heat.

Electronic device having infrared sensing elements

An optical delay line of a configuration in which a number of components such as a circulator and an optical coupler is reduced is to be provided. To this end, the optical delay line has a configuration in which, after an optical fiber diffraction grating having a core subjected to refractive index modulation and a cladding partly cleared of its outer circumference and an optical fiber having a cladding partly cleared of its outer circumference are brought close to each other so that the cores have mutually parallel directions of an optical axis to fabricate a directional coupler, both ends of the optical fiber are connected into an optical fiber loop. In this way, an optical delay line to generate a specific time delay for controlling optical signals can be provided in small dimensions and with a small number of components.

Optical delay line and manufacturing method therefor

It includes: a substrate; a plurality of optical data processing units arranged in an array on the substrate, a super graphite sheet on LEDs of the optical processing units, and a glass substrate on the super graphite sheet. Each optical data processing unit includes an optical signal receiving circuit on the substrate for receiving an optical signal and generating a reception signal; a data processing circuit on the substrate for processing the reception signal and generating resultant data; a drive circuit and an LED on the substrate for emitting an output optical signal and heat in accordance with the resultant data. The super graphite sheet on the LED transmits and radiates the heat from the LEDs. The super graphite film is provided by sintering a high polymer sheet and has a high heat conductivity. The optical signal receiving circuit receives the optical signal through the glass substrate or through the substrate made of silicon of which thickness is reduced for providing transparency or in which a through hole is formed. An optical data processing system including a plurality of optical data processing apparatus are coupled directly or through a coupling optics or a coupling optical system.

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Tokyo, Japan

Asako Baba