Asahi Glass Company, Limited

Asahi Ide

Sohei Kawanami

Koichi Shibuya

The invention seeks to increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substratehas a sealing region. On the sealing region, a sealing material layercomprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layerand contains low-expansion filler particles having particle sizes within a range of from 0.5T to 1T based on the thickness T of the sealing material layerin a volume ratio of from 0.1 to 50%. Such a glass substrateand a glass substratehaving an element-formed region provided with an electronic element are laminated, and the sealing material layeris irradiated with a laser lightand melted to bond the glass substratesand

Glass member provided with sealing material layer, and electronic device using it and process for producing the electronic device

The present invention provides a frit containing substantially no lead, which is applicable to a member having &#x3b1; of at most 50&#xd7;10/&#xb0; C. A frit comprising a low-melting point glass powder and a refractory filler powder, containing substantially no lead, having a thermal expansion coefficient of at most 50&#xd7;10/&#xb0; C., and being processable at 500&#xb0; C. or lower, wherein the above low-melting point glass powder satisfies a softening pour point range of at least 30&#xb0; C., and the above refractory filler powder satisfies the following relationship:1&#x3c;S&#xd7;&#x3c1;&#x3c;10

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Asahi Ide