Mellanox Technologies Tlv Ltd.

Asaf Horev

Ran Ravid

Guy Lederman

A Multi-Chip-Module (MCM) includes an MCM substrate and at least a data producing IC (DPIC) and a data-consuming IC (DCIC), both mounted on the MCM substrate and connected to one another through a high-speed bus having a fixed data rate. The DPIC is configured to send data to the DCIC by alternating between (i) first time periods during which the DPIC sends over the bus both produced data and dummy data that together have the fixed data rate of the bus, and (ii) second time periods during which the DPIC sends over the bus only dummy data at the fixed data rate, wherein a rate of the produced date and durations of the first time periods and the second time periods, are preset.

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Rishon Lezion, Israel

Asaf Horev