Applied Materials, Inc.

Arvinder Manmohan Singh Chadha

Vijay D Parkhe

Glen T Mori

Christopher L Beaudry

A method including using a plurality of clamp electrodes of a substrate support to electrostatically secure a substrate during a process. The method further includes actively discharging a residual charge from the substrate after completion of the process based on at least one of contacting a backside of the substrate with a conductive lift pin or exposing the substrate to ultraviolet light. The method further includes raising a plurality of lift pins disposed in the substrate support to a first height to lift the substrate off of the substrate support after the discharging of the residual charge.

Efficient dechucking and particle management in process chambers

An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.

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San Jose, CA, United States of America

Arvinder Manmohan Singh Chadha