Applied Materials, Inc.

Arvind Thiyagarajan

Kyle Moran Hanson

Manoj A Gajendra

Jon Christian Farr

Mahadev Joshi

Methods and apparatus for removing substrate contamination are provided herein. In some embodiments, a multi-chamber processing apparatus includes: a processing chamber for processing a substrate; a factory interface (FI) coupled to the processing chamber via a load lock chamber disposed therebetween; and a cleaning chamber coupled to the FI and configured to rinse and to dry the substrate, wherein the cleaning chamber includes a chamber body defining an interior volume and having a first opening at an interface with the FI for transferring the substrate into and out of the interior volume.

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Bengaluru, India

Arvind Thiyagarajan