Com Dev Limited

Com Dev International, Inc.

Arvind Swarup

David Davitt

A transmission line circuit assembly has a substrate layer having a transmission line trace, further having a functional portion and a transitional portion. An enclosure of the assembly houses the transitional portion of the transmission line trace. A first surface of a dielectric plug is conductively coupled to an inner top surface of the enclosure. A second surface of the plug is aligned and spaced apart from the transitional portion of the transmission line trace to define a gap therebetween. An interfacing portion of a connecting pin is housed within the enclosure and bonded to the transitional portion. A connecting portion of the pin is connectable to an external conductor. The gap may be filled with a dielectric material. The transitional portion, dielectric plug, dielectric filler and connecting pin form an electromagnetic transition providing tuning and matching of the function portion with the external conductor.

Transmission line circuit assemblies and processes for fabrication

A novel circuit packaging structure including a combination of printed lumped elements within a multi-layer stripline architecture is provided and methods of making the same. The lumped elements are provided by printing the individual passive elements, including interdigital capacitors and spiral inductors, onto the supporting substrate and then embedding these elements into the multi-layer stripline structure. The stripline structure consists of a signal layer sandwiched between at least two ground layers separated by two dielectric substrates of equal thickness. This ground-signal-ground approach confines the electromagnetic fields within the multi-layer structure, thereby minimizing radiation from coupling to nearby components. This approach offers a unique combination of stripline technology and printed lumped elements resulting in miniaturized radio frequency and microwave circuits at operating at frequencies well below 1 GHz, up to several GHz.

Printed lumped element stripline circuit structure and method

Printed lumped element stripline circuit ground-signal-ground structure

A power divider has a microstripline circuit with bandpass filters at each output that are lumped element printed bandpass filters. The filters widen the isolation bandwidth of the divider. Power dividers can be reversed for use as power combiners.

Growing community of inventors

Kitchener, Canada

Arvind Swarup