Rockley Photonics Limited

Arvind Jaikumar

Chia-Te Chou

Moshe Amit

A bonding fixture. In some embodiments, the fixture includes: a plate for supporting a central region of the wafer, the central region including 80% of the area of the wafer; and a frame for supporting: the edge of the wafer, and the edge of the plate, the frame having: a first vacuum passage, for pulling the wafer against an upper surface of the frame, and a second vacuum passage, for pulling the plate against the frame.

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Rancho Cucamonga, CA, United States of America

Arvind Jaikumar