Gtat Corporation

Merlin Solar Technologies, Inc.

Arvind Chari

Venkatesan Murali

Gopal Prabhu

Robert Brainard

Venkateswaran Subbaraman

Steve E Babayan

Alejandro De La Fuente Vornbrock

Dong Xu

David Tanner

Arthur Rudin

Jesse Dam

Christopher John Petti

Kent Riley Child

Adam Brailove

Steve Babayan

A method includes providing an electrically conductive mandrel having an outer surface layer comprising a preformed pattern. The metallic article is electroformed. The metallic article includes a plurality of electroformed elements formed in the preformed pattern on the outer surface layer of the mandrel. The plurality of electroformed elements have a first side adjacent to the outer surface layer of the mandrel and a second side. The metallic article is separated from the mandrel. The plurality of electroformed elements are interconnected such that the metallic article forms a unitary, free-standing piece. A solution is applied to create a blackening of the first side of the plurality of electroformed elements.

Method for blackening a metallic article

A method includes providing an electrically conductive mandrel having an outer surface layer comprising a preformed pattern. The metallic article is electroformed. The metallic article includes a plurality of electroformed elements formed in the preformed pattern on the outer surface layer of the mandrel. The plurality of electroformed elements have a first side adjacent to the outer surface layer of the mandrel and a second side. A solder is plated on the second side of the plurality of electroformed elements while on the mandrel. The metallic article is separated from the mandrel. The plurality of electroformed elements are interconnected such that the metallic article forms a unitary, free-standing piece. A solution is applied to create a blackening of the first side of the plurality of electroformed elements. The solder on the second side of the plurality of electroformed elements is not blackened.

A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.

Free-standing metallic article for semiconductors

A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.

Adaptable free-standing metallic article for semiconductors

A method for fabricating a backside-illuminated sensor includes providing a thin film semiconductor lamina having a first conductivity, and forming a doped region having a second conductivity within the lamina and at a front surface of the lamina. The lamina may be provided as a free-standing lamina, or may be provided as a semiconductor donor body from which the lamina is cleaved. An electrical connection is formed to the doped region. A temporary carrier is contacted to the back surface of the semiconductor and later removed. A backside-illuminated sensor is fabricated from the semiconductor lamina, in which the thickness of the semiconductor lamina remains substantially unchanged during the fabrication process.

Method for fabricating backside-illuminated sensors

An interposer is fabricated from a lamina. A donor body is provided, ions are implanted into a first surface of the donor body to define a cleave plane, a temporary carrier is separably contacted to the donor body, and the lamina is cleaved from the donor body. The lamina has front surface and a back surface, with a thickness from the front surface to the back surface. A via hole is formed in the lamina, where the via hole extends through the thickness of the lamina. The temporary carrier is removed from the lamina, and the lamina may be fabricated into an interposer for three-dimensional integrated circuit packages.

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Saratoga, CA, United States of America

Arvind Chari