Wacker Chemie Ag

Arvid Kuhn

Young-Jin Kim

Frank Sandmeyer

Young-jin Kim

Michael Stepp

Young-Hyuk Joo

Hyun-Kwan Yang

Armin Fehn

Stefan Dietl

Erich Pilzweger

Brigitte Hergert

Inge Schreiber

Werner Guske

Birgit Auzias

A curable organopolysiloxane composition, a Light Emitting Diode (LED) encapsulant and a semiconductor device, employ a curable organopolysiloxane composition containing a branched organopolysiloxane bearing alkenyl groups and aryl groups, a linear organopolysiloxnae bearing terminal Si&#x2014;H functionality, and a low molecular weight component having at least one alkenyl group. As an encapsulant, the composition displays improved stability.

Curable organopolysiloxane composition, encapsulant and semiconductor device

Unique compositions containing organopolysiloxanes having both silicon-bonded hydrogen and aliphatically unsaturated groups exhibit robust processing characteristics and provide coatings or encapsulations of high transparency which can withstand numerous temperature cycles without failure.

Siloxane resin compositions

Highly adhesive, soft silicone gels are prepared from an aliphatically unsaturated organopolysiloxanes and an organosilicon compound crosslinker of high molecular weight and a very low silicon-bonded hydrogen content.

Silicone composition crosslinkable to give silicone gel

Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.

Cast silicone compositions with high transparency suitable for use as optical components contain a base polymer with a refractive index &#x2265;1.42, and a reinforcing particulate silica which is surface modified to have a refractive index within 0.03 of the refractive index of the base polymer, by reaction with an aryl-silane or aryl-siloxane.

Curable, highly transparent silicone composition with improved mechanics, for optical components

A primer composition for silicone rubbers, in particular for addition-crosslinking silicone rubbers, comprises a tetraalkoxysilane and/or partial hydrolysate thereof, a metal salt, alkoxide, or chelate and/or partial hydrolysate thereof, a silicone resin, and from 50-95% by weight of solvent. The primer provides excellent adhesion between silicone rubber and numerous substrates.

Primer for heat-curable silicone elastomers

Silicone rubber compositions useful for high-voltage insulators, and which cure to give silicone rubbers having a low combustibility, are addition-crosslinkable or peroxide-crosslinkable silicone rubber compositions containing aluminum hydroxide as filler, with the uncrosslinked composition having a storage stability which is improved compared to the prior art and improved processing properties by including an acid, base, or a compound which liberates an acid or base upon heating. These improved properties are achieved both with surface-treated aluminum hydroxide and with untreated aluminum hydroxide.

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Burghausen, Germany

Arvid Kuhn