Microsoft Technology Licensing, LLC

Arunkumar Chacko

Abhishek Agarwal

Ramachandran Venkatesh

Wilbert De Graaf

Balasubramanian Sriram

Anush Kumar

Gregory Gourevitch

Janaki Ram Goteti

Krishnan Gopalan

Jayaram Kalyana Sundaram

Anil Kumar Prasad

Pamela J Scott

A client computer sends an extended simple mail transfer protocol extended hello command to a server computer. In response, the server computer sends an advertisement to the client computer to identify a capability to receive message context information. The client computer, in turn, analyzes the capability advertisement to determine if it has any blobs associated with the capability identified in the capability advertisement to send. If the client computer has one or more blobs to send, the client computer sends a parameter in a MAIL command to the server computer specifying that the client computer will utilize the capability identified in the capability advertisement and specifying an order in which to expect the blobs if the client computer intends to send more than one blob. The client computer sends the blob(s) to the server computer after receiving an indication that the server computer is ready to receive the blob(s).

Transferring message context information using extended simple mail transfer protocol binary data chunking

The claimed subject matter provides a system and/or a method that facilitates implementing a binding between a radio frequency identification (RFID) process and a device. An RFID process can receive a tag read event from a device and make the tag read event available for at least one high level application. A binding engine can bind the RFID process to the device while decoupling a design time activity and a deployment time activity associated with the RFID process. In addition, the binding engine can include at least one of a device mapping component that employs a device binding; and a component configuration module that employs a component binding.

RFID business process-decoupling of design and deployment time activities

Growing community of inventors

Redmond, WA, United States of America

Arunkumar Chacko