Intel Corporation

Arun Krishnamoorthy

Abram M Detofsky

Prabhakar Subrahmanyam

Joseph F Walczyk

Pooya Tadayon

James G Maveety

Ashish Gupta

Paul J Diglio

Jin Yang

Todd P Albertson

Jin Pan

Ying-Feng Pang

Christopher Roy Schroeder

Yi Xia

Victor Polyanko

Rahima K Mohammed

Sruti Chigullapalli

Todd Michael Young

Lothar Kress

Charles Clifton Fulton

Mo S Bashir

David Won-jun Song

Robert Levi Bennett

Muhammad Ahmad

An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.

Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips

Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

Jet vectoring fluid impingement cooling using pivoting nozzles

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.

Thermal interface material handling for thermal control of an electronic component under test

A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).

Thermal interface for multi-chip packages

Apparatuses, methods, and systems associated with and/or having components capable of, detecting a temperature of an integrated circuit in real time during testing are disclosed herein. In exemplary embodiments, an integrated circuit includes a register to store a temperature limit for the integrated circuit; a temperature sensor formed on the integrated circuit to sense a temperature of the integrated circuit, and output a signal indicative of the temperature sensed, based at least in part on the temperature sensed; and testing logic coupled to the register and the temperature sensor to record a temperature violation if at any time during a testing mode of operation the temperature sensed by the temperature sensor violates the stored temperature limit.

Real-time temperture detection during test

A method includes providing an integrated circuit (IC) having a plurality of oscillators at distributed locations in the IC, determining a respective rate of oscillation of each of the oscillators, and detecting variations in local temperature in the IC based on the determined rates of oscillation. Other embodiments are described and claimed.

Mapping variations in local temperature and local power supply voltage that are present during operation of an integrated circuit

Growing community of inventors

Portland, OR, United States of America

Arun Krishnamoorthy