Intel Corporation

Arun Chandrasekhar

Johanna M Swan

Adel A Elsherbini

Shawna M Liff

Amr Elshazly

Amruthavalli Pallavi Alur

Charan K Gurumurthy

Robert Fite

Srikrishnan Venkataraman

Venkat Natarajan

Shamala Chickamenahalli

Jonathan Rosch

Vittal Kini

Priyavadan R Patel

Pr Patel

Shawna M Lift

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

Microelectronic assemblies

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

Microelectronic assemblies with communication networks

Growing community of inventors

Chandler, AZ, United States of America

Arun Chandrasekhar