Cheil Industries Inc.

Samsung Sdi Co., Inc.

Kudko Chemical Co., Ltd.

Ulsan National Institute of Science and Technology

Arum Yu

Young Woo Park

Hyun Min Choi

Dong Seon Uh

Kyoung Soo Park

Joon Mo Seo

Nam Ju Kim

Kyung Il Sul

Seung-Jib Choi

Hyun-Moo Choi

Jun-Ho Lee

Ji-Hye Kim

Kyung-Won Ahn

Ho-Jeong Paek

Chaehyuk Ko

Sundae Kim

Myungho Cho

Ieju Kim

Jin-Woo Park

Junho Lee

Ji Eun Kim

Chang-Min Lee

Harim Lee

Nam-Soon Choi

Hojeong Paek

Yunhee Kim

Xinhui Feng

Yeji Yang

Jae Sun Han

Jong Hyuk Eun

Jin Seong Park

Young Joon Lee

Seungjib Choi

Jungsun Lee

Haeni Song

Young-Tai Lee

Young Gi Lee

Do-Uk Kim

Hye-Min Lee

Tae Hyon Bae

Hyunmoo Choi

Sanghyung Kim

Seunghyeon Son

Saehun Kim

Jeong-A Lee

A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer produced using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1; and a shell surrounding the core, the shell being represented by Chemical Formula 2:

Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor

A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a squarylium core including three or more (meth)acrylate groups and a shell surrounding the squarylium core.

A semiconductor device includes a first connecting member having a first electrode, a second connecting member having a second electrode, and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other. The anisotropic conductive film includes a polymer binder resin, an epoxy resin, conductive particles, and a curing agent. The epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin. The naphthalene ring-containing epoxy resin is included in an amount of 100 parts by weight to 500 parts by weight based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin.

Semiconductor device connected by anisotropic conductive film

A photosensitive resin composition includes (A) a black colorant having a maximum transmittance in an ultraviolet (UV) wavelength range/minimum transmittance in a visible ray wavelength range of about 30 or greater, (B) a binder resin; (C) a photopolymerization initiator; (D) a photopolymerizable monomer; and (E) a solvent. A black column spacer using the photosensitive resin composition, and a color filter including the black column spacer are provided.

Photosensitive resin composition, black column spacer using the same and color filter

A liquid crystal display (LCD) includes a thin film transistor positioned on a lower substrate; a plurality of color filters positioned on the thin film transistor and aligned to be spaced apart from each other; an insulation layer positioned on the plurality of color filters; a light-blocking layer positioned on the insulation layer; a transparent layer positioned on the light-blocking layer and having a convex shape; an upper substrate facing the lower substrate; and a liquid crystal layer interposed between the lower substrate and the upper substrate, wherein the light-blocking layer includes an organic black pigment, and the transparent layer having the convex shape has a different shape from the light-blocking layer.

Liquid crystal display

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

Anisotropic conductive film and semiconductor device bonded by the same

An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, Rmay be selected from the group of hydrogen, C-Calkyl, C-Caryl, &#x2014;C(&#x2550;O)R, &#x2014;C(&#x2550;O)OR, and &#x2014;C(&#x2550;O)NHR(in which R, R, and Rmay each independently be selected from C-Calkyl and C-Caryl), Rmay be C-Calkyl, and Rmay be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C-Calkyl-substituted benzyl group, and a naphthylmethyl group.

Electronic device using anisotropic conductive composition and film

Disclosed are a black photosensitive resin composition including (A) a binder resin; (B) a colorant including a pigment and a silica nanoparticle; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) a solvent, wherein the silica nanoparticle is included in an amount of about 1 part by weight to about 11 parts by weight based on about 100 parts by weight of the pigment, and a light blocking layer and a color filter using the same.

Black photosensitive resin composition and light blocking layer using the same

An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa&#xb7;s to about 10,000 Pa&#xb7;s at about 30&#xb0; C. to about 200&#xb0; C.

Anisotropic conductive film and apparatus including the same

Disclosed are a method of manufacturing a black column spacer that includes preparing a substrate; forming a first organic layer on the substrate; forming a second organic layer on the first organic layer; performing exposure on the substrate on which the first organic layer and the second organic layer are formed using a half-tone mask; and developing the substrate and curing the resultant product, a black column spacer manufactured using the manufacturing method, and a color filter including the black column spacer.

Method of manufacturing black column spacer, black column spacer, and color filter

An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

Anisotropic conductive film and electronic device including the same

An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: 

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same

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Uiwang-si, South Korea

Arum Yu