Advanced Micro Devices Corporation

Arturo Nicholas Morosoff

David E Brown

Allen Lewis Evans

Michael J Satterfield

Hang Thi Yen Black

Joseph Lebowitz

Hang T Black

The method disclosed herein provides a semiconducting substrate, positioning the substrate in a high density plasma process chamber, and forming a layer of silicon-rich silicon dioxide above the substrate using a high density plasma process with an oxygen/silane flowrate ratio that is less than or equal to 0.625. In another embodiment, the method provides a semiconducting substrate having a partially formed integrated circuit device formed thereabove, the integrated circuit device having a plurality of conductive interconnections, e.g., conductive lines or conductive plugs, formed thereon, and positioning the substrate in a high density plasma process chamber. The method further includes forming a first layer of silicon dioxide between the plurality of conductive interconnections using a high density plasma process with an oxygen/silane flowrate ratio less than 1.0, and forming a layer of insulating material above the first layer between the conductive interconnections. In another aspect of the present invention, an integrated circuit device has of a plurality of conductive interconnections, e.g., conductive lines, formed above a semiconducting substrate, a layer of silicon dioxide having a silicon content ranging from approximately 50-75 weight percent positioned between the conductive inter-connections, and a layer of insulating material positioned above the layer of silicon dioxide between the conductive interconnections.

Method for preventing or reducing delamination of deposited insulating layers

A system and method for recording and addressing out of control (OOC) events in a semiconductor processing line. The method includes steps of (a) opening OOC entries in an OOC database, and (b) working the OOC entries. Opening an OOC entry is performed in response to one or more OOC events in wafer lots being processed in the semiconductor processing line. A lot record addresses an isolated occurrence pertaining to one wafer lot. An issue record addresses a trend of repeated defects or failures. Opening an OOC entry in the OOC database preferably includes assigning and recording an &ldquo;owner&rdquo; responsible for addressing the OOC entry. Working the OOC entries includes opening activity records for the OOC entries, receiving user input on corrective measures, and recording the measures in the activity records. The method preferably also includes steps of (c) closing OOC entries after working the OOC entries, and (d) reassigning OOC entries if ownership is transferred for the entries. The system includes (a) a plurality of computer systems, including a plurality of entry terminals, (b) an OOC database coupled to the plurality of computer systems, (c) an OOC interface executing on one or more of the entry terminals and coupled to the OOC database, and (d) an OOC tracking program executing on one or more of the computer systems and coupled to the OOC database and to the OOC interface.

System and method for corrective action tracking in semiconductor processing

A method, system, and storage medium for increasing the efficiency of integrated circuit (IC) manufacture by improvements in manufacturing equipment usage are provided. Process tools are assigned to one of three operating states: up, down, or conditional. In the up state, process tools are available for manufacturing. After certain manufacturing steps, the quality of the ICs being made upon wafers is evaluated. If potentially defective ICs are found, process tools that have processed the wafer may be placed in the conditional state. In this state, process tools are allowed to continue manufacturing, albeit only for a limited period. The conditional state gives personnel time to determine which process tool is responsible for the defective product. The responsible process tool is then placed in the down state while all others are placed back in the up state. Once the problem with the process tool in the down state is presumably repaired, it is placed in the conditional state. If the limited quantity of wafers then processed by the process tool are found to be acceptable, the tool is placed in the up state; otherwise, it is placed back in the down state. The conditional state allows personnel to investigate the problem without halting production and determine the exact process tool to take out of production while the limited period of the conditional state limits the quantity of potentially defective product.

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Austin, TX, United States of America

Arturo Nicholas Morosoff